| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Card Type | Gender | Number of Positions | Card Thickness | Number of Rows | Color | Pitch | Read Out | Number of Positions/Bay/Row | Features | Mounting Style | Contact Type | Termination | Flange Feature | Contact Finish Thickness | Contact Material | Contact Finish | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PCIE-164-02-F-D-EMS3-BGCONN PCI EXP FMALE 164POS 0.039 Samtec Inc. |
3,320 |
|
- |
PCI Express® (PCIe) | Tube | Active | PCI Express™ | Female | 164 | 0.062" (1.57mm) | 2 | Black | 0.039" (1.00mm) | Dual | - | Board Guide | Board Edge, Straddle Mount | - | Solder | - | 3.00µin (0.076µm) | Phosphor Bronze | Gold | -55°C ~ 125°C |
|
HSEC8-160-03-L-DV-A-WTCONN EDGE DUAL FML 120POS 0.031 Samtec Inc. |
3,745 |
|
Datasheet |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 120 | 0.093" (2.36mm) | 2 | Black | 0.031" (0.80mm) | Dual | 60 | Board Guide, Solder Retention | Surface Mount | Cantilever | Solder | - | 10.0µin (0.25µm) | Beryllium Copper | Gold | -55°C ~ 125°C |
|
HSEC8-137-01-S-D-EM2CONN EDGE DUAL FMALE 74POS 0.031 Samtec Inc. |
4,428 |
|
Datasheet |
Edge Rate™ HSEC8 | Tube | Active | Non Specified - Dual Edge | Female | 74 | 0.062" (1.57mm) | 2 | Black | 0.031" (0.80mm) | Dual | 37 | - | Board Edge, Straddle Mount | Cantilever | Solder | - | 30.0µin (0.76µm) | Beryllium Copper | Gold | -55°C ~ 125°C |
|
HSEC8-190-01-S-DV-A-BL-KCONN EDGE DUAL FML 180POS 0.031 Samtec Inc. |
4,976 |
|
Datasheet |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 180 | 0.062" (1.57mm) | 2 | Black | 0.031" (0.80mm) | Dual | 90 | Board Guide, Board Lock | Surface Mount | Cantilever | Solder | - | 30.0µin (0.76µm) | Beryllium Copper | Gold | -55°C ~ 125°C |
|
MEC8-170-01-L-D-EM2CONN EDGE DUAL FML 140POS 0.031 Samtec Inc. |
2,882 |
|
- |
MEC8 - EM | Tube | Active | Non Specified - Dual Edge | Female | 140 | 0.039" (1.00mm) | 2 | Black | 0.031" (0.80mm) | Dual | - | - | Board Edge, Straddle Mount | Hairpin Bellows | Solder | - | 10.0µin (0.25µm) | Phosphor Bronze | Gold | -55°C ~ 125°C |
|
HSEC8-1100-01-L-DVCONN EDGE DUAL FML 200POS 0.031 Samtec Inc. |
4,583 |
|
Datasheet |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 200 | 0.062" (1.57mm) | 2 | Black | 0.031" (0.80mm) | Dual | 100 | - | Surface Mount | Cantilever | Solder | - | 10.0µin (0.25µm) | Beryllium Copper | Gold | -55°C ~ 125°C |
|
HSEC8-137-01-H-DV-A-WT0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc. |
2,088 |
|
Datasheet |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 74 | 0.062" (1.57mm) | 2 | Black | 0.031" (0.80mm) | Dual | 37 | Board Guide, Solder Retention | Surface Mount | Cantilever | Solder | - | 30.0µin (0.76µm) | Beryllium Copper | Gold | -55°C ~ 125°C |
|
HSEC8-140-01-S-PV-2-20.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc. |
3,405 |
|
Datasheet |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 82 (80 + 2 Power) | 0.062" (1.57mm) | 2 | Black | 0.031" (0.80mm) | Dual | 40; 2 | - | Surface Mount, Through Hole | Cantilever | Solder | - | 30.0µin (0.76µm) | - | Gold | -55°C ~ 125°C |
|
HSEC8-140-01-S-PV-4-2-WT0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc. |
3,135 |
|
Datasheet |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 84 (80 + 4 Power) | 0.062" (1.57mm) | 2 | Black | 0.031" (0.80mm) | Dual | 40; 2; 2 | Board Guide, Solder Retention | Surface Mount, Through Hole | Cantilever | Solder | - | 30.0µin (0.76µm) | Beryllium Copper | Gold | -55°C ~ 125°C |
|
HSEC8-1100-01-L-DV-K0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc. |
2,617 |
|
Datasheet |
Edge Rate™ HSEC8 | Bulk | Active | PCI Express™ | Female | 200 | 0.062" (1.57mm) | 2 | Black | 0.031" (0.80mm) | Dual | 32; 68 | Pick and Place | Surface Mount | Cantilever | Solder | - | 10.0µin (0.25µm) | Beryllium Copper | Gold | -55°C ~ 125°C |