| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Capacitance | Tolerance | Temperature Coefficient | Operating Temperature | Features | Lead Style | Ratings | Part Applications | Voltage - Rated | Failure Rate | Mounting Style | Lead Spacing | Package / Case | Thickness (Max) | Size / Dimension | Height - Seated (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
C1210C226M8PALTUCAP CER 1210 KEMET |
4,569 |
|
Datasheet |
SMD Comm X5R SnPb | Tape & Reel (TR) | Active | 22 µF | ±20% | X5R | -55°C ~ 85°C | - | - | - | Bypass, Decoupling | 10V | - | Surface Mount, MLCC | - | 1210 (3225 Metric) | 0.067" (1.70mm) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - |
|
F462RD155M1K0ZCAP KEMET |
2,241 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CKC21X512GCGAC7800KC-LINK 2220 5.1NF 500VDC C0G KEMET |
4,920 |
|
Datasheet |
KC Link Comm C0G | Tape & Reel (TR) | Active | 5100 pF | ±2% | C0G, NP0 | -55°C ~ 150°C | Low ESL, Soft Termination, High Voltage, High Temperature | - | - | Boardflex Sensitive | 500V | - | Surface Mount, MLCC | - | 2220 (5750 Metric) | 0.087" (2.20mm) | 0.232" L x 0.197" W (5.90mm x 5.00mm) | - |
|
CKC18X393FWGAC7800KC-LINK 1812 39NF 650VDC C0G KEMET |
2,120 |
|
Datasheet |
KC Link Comm C0G | Tape & Reel (TR) | Active | 0.039 µF | ±1% | C0G, NP0 | -55°C ~ 150°C | Low ESL, Soft Termination, High Voltage, High Temperature | - | - | Boardflex Sensitive | 650V | - | Surface Mount, MLCC | - | 1812 (4532 Metric) | 0.106" (2.70mm) | 0.177" L x 0.126" W (4.50mm x 3.20mm) | - |
|
C350C474K2R5CA.470UF 200V KEMET |
3,274 |
|
- |
GoldMax 300 Comm X7R | Bag | Active | 0.47 µF | ±10% | X7R | -55°C ~ 125°C | - | Formed Leads | - | Bypass, Decoupling | 200V | - | Through Hole | 0.400" (10.16mm) | Radial | - | 0.330" L x 0.200" W (8.38mm x 5.08mm) | 0.400" (10.16mm) |
|
C052C821F1G5TACAP CER RAD KEMET |
2,009 |
|
Datasheet |
LDD Comm C0G | Bulk | Active | 820 pF | ±1% | C0G, NP0 | -55°C ~ 125°C | Low ESL | Formed Leads | - | General Purpose | 100V | - | Through Hole | 0.200" (5.08mm) | Radial | - | 0.190" L x 0.090" W (4.83mm x 2.29mm) | 0.245" (6.22mm) |
|
C052C821F2G5CACAP CER RAD KEMET |
4,224 |
|
Datasheet |
LDD Comm C0G | Bulk | Active | 820 pF | ±1% | C0G, NP0 | -55°C ~ 125°C | Low ESL | Formed Leads | - | General Purpose | 200V | - | Through Hole | 0.200" (5.08mm) | Radial | - | 0.190" L x 0.090" W (4.83mm x 2.29mm) | 0.245" (6.22mm) |
|
C052C272F1G5CACAP CER RAD KEMET |
4,091 |
|
Datasheet |
LDD Comm C0G | Bulk | Active | 2700 pF | ±1% | C0G, NP0 | -55°C ~ 125°C | Low ESL | Formed Leads | - | General Purpose | 100V | - | Through Hole | 0.200" (5.08mm) | Radial | - | 0.190" L x 0.090" W (4.83mm x 2.29mm) | 0.245" (6.22mm) |
|
|
C1210C475K3N1CAUTOCAP CER 4.7UF 25V X8L SMD KEMET |
3,094 |
|
Datasheet |
KPS SMD Auto X8L HT150C | Tape & Reel (TR) | Active | 4.7 µF | ±10% | X8L | -55°C ~ 150°C | Low ESL, High Temperature | J-Lead | AEC-Q200 | Automotive, Bypass, Decoupling, Boardflex Sensitive | 25V | - | Surface Mount, MLCC | - | SMD, J-Lead | 0.136" (3.45mm) | 0.138" L x 0.102" W (3.50mm x 2.60mm) | - |
|
C1210C683J1GACAUTOCAP CER 0.068UF 100V 1210 KEMET |
3,066 |
|
Datasheet |
SMD Auto C0G | Tape & Reel (TR) | Active | 0.068 µF | ±5% | C0G, NP0 | -55°C ~ 125°C | Low ESL | - | AEC-Q200 | Automotive | 100V | - | Surface Mount, MLCC | - | 1210 (3225 Metric) | 0.055" (1.40mm) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - |