| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Package/Case | Series | Packaging | Part Status | Programmable | Core Processor | Speed | Connectivity | Peripherals | Grade | Number of I/O | Program Memory Size | Core Size | Program Memory Type | EEPROM Size | Operating Temperature | RAM Size | Qualification | Oscillator Type | Voltage - Supply (Vcc/Vdd) | Data Converters | Mounting Style | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
S9KEAZN32BMLCRIC MCU NXP USA Inc. |
3,620 |
|
- |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
MC9S08PT32AVLCIC MCU 8BIT 32KB FLASH 32LQFP NXP USA Inc. |
4,020 |
|
Datasheet |
32-LQFP | S08 | Tray | Active | Not Verified | S08 | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 28 | 32KB (32K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 4K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b | Surface Mount | |
|
MC908JB8JDWERIC MCU 8BIT 8KB FLASH 20SOIC NXP USA Inc. |
4,181 |
|
Datasheet |
20-SOIC (0.295", 7.50mm Width) | HC08 | Tape & Reel (TR) | Obsolete | Not Verified | HC08 | 3MHz | USB | LVD, POR, PWM | - | 13 | 8KB (8K x 8) | 8-Bit | FLASH | - | 0°C ~ 70°C (TA) | 256 x 8 | - | Internal | 4V ~ 5.5V | - | Surface Mount | |
|
LPC1113FHN33/302:5IC MCU 32BIT 24KB FLASH 32HVQFN NXP USA Inc. |
2,318 |
|
Datasheet |
32-VQFN Exposed Pad | LPC1100L | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 28 | 24KB (24K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
S9KEAZN16AMLHRIC MCU 32BIT 16KB FLASH 64LQFP NXP USA Inc. |
2,539 |
|
Datasheet |
64-LQFP | Kinetis KEA | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 40MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 57 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | 256 x 8 | -40°C ~ 125°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b SAR | Surface Mount | |
|
MC9RS08KA4CPJIC MCU 8BIT 4KB FLASH 20DIP NXP USA Inc. |
7 |
|
Datasheet |
20-DIP (0.300", 7.62mm) | RS08 | Tube | Obsolete | Not Verified | RS08 | 20MHz | I2C | LVD, POR, PWM, WDT | - | 18 | 4KB (4K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 126 x 8 | - | Internal | 1.8V ~ 5.5V | A/D 12x10b | Through Hole | |
|
C9KEAZN32AMLCC9KEAZN32AMLC NXP USA Inc. |
4,107 |
|
- |
32-LQFP | Kinetis KEA | Bulk | Active | - | ARM® Cortex®-M0+ | 40MHz | I2C, SPI, UART/USART | LVD, PMC, PWM, WDT | - | 57 | 32KB (32K x 8) | 32-Bit | FLASH | 256K x 8 | -40°C ~ 125°C (TA) | 4K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b SAR | Surface Mount | |
|
LPC1112FHI33/202,5IC MCU 32BIT 16KB FLASH 32HVQFN NXP USA Inc. |
4,548 |
|
Datasheet |
32-VFQFN Exposed Pad | LPC1100L | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 28 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 4K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
S9S08SG4E2VTGIC MCU 8BIT 4KB FLASH 16TSSOP NXP USA Inc. |
3,747 |
|
Datasheet |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 12 | 4KB (4K x 8) | 8-Bit | FLASH | - | -40°C ~ 105°C (TA) | 256 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
S9S08SG4E2VTGRIC MCU 8BIT 4KB FLASH 16TSSOP NXP USA Inc. |
3,952 |
|
Datasheet |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 12 | 4KB (4K x 8) | 8-Bit | FLASH | - | -40°C ~ 105°C (TA) | 256 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 8x10b | Surface Mount |