| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Flat Flex Type | Mounting Style | Number of Positions | Pitch | Termination | Voltage Rating | FFC, FCB Thickness | Height Above Board | Connector/Contact Type | Locking Feature | Cable End Type | Features | Contact Material | Operating Temperature | Actuator Material | Contact Finish | Housing Material | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FA5S010HP1CONN FPC BOTTOM 10POS 0.5MM R/A JAE Electronics |
2,524 |
|
Datasheet |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | 10 | 0.020" (0.50mm) | Solder | 50V | 0.30mm | 0.057" (1.45mm) | Contacts, Bottom | Flip Lock | Tapered | Solder Retention, Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyamide (PA), Nylon, Glass Filled | Gold | Liquid Crystal Polymer (LCP), Glass Filled | UL94 V-0 |
|
FA5S015HP1CONN FPC BOTTOM 15POS 0.5MM R/A JAE Electronics |
2,114 |
|
Datasheet |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | 15 | 0.020" (0.50mm) | Solder | 50V | 0.30mm | 0.057" (1.45mm) | Contacts, Bottom | Flip Lock | Tapered | Solder Retention, Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyamide (PA), Nylon, Glass Filled | Gold | Liquid Crystal Polymer (LCP), Glass Filled | UL94 V-0 |
|
FA5S018HP1CONN FPC BOTTOM 18POS 0.5MM R/A JAE Electronics |
3,998 |
|
Datasheet |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | 18 | 0.020" (0.50mm) | Solder | 50V | 0.30mm | 0.057" (1.45mm) | Contacts, Bottom | Flip Lock | Tapered | Solder Retention, Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyamide (PA), Nylon, Glass Filled | Gold | Liquid Crystal Polymer (LCP), Glass Filled | UL94 V-0 |
|
FA5S020HP1CONN FPC BOTTOM 20POS 0.5MM R/A JAE Electronics |
2,648 |
|
Datasheet |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | 20 | 0.020" (0.50mm) | Solder | 50V | 0.30mm | 0.057" (1.45mm) | Contacts, Bottom | Flip Lock | Tapered | Solder Retention, Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyamide (PA), Nylon, Glass Filled | Gold | Liquid Crystal Polymer (LCP), Glass Filled | UL94 V-0 |
|
FA5S026HP1CONN FPC BOTTOM 26POS 0.5MM R/A JAE Electronics |
2,246 |
|
Datasheet |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | 26 | 0.020" (0.50mm) | Solder | 50V | 0.30mm | 0.057" (1.45mm) | Contacts, Bottom | Flip Lock | Tapered | Solder Retention, Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyamide (PA), Nylon, Glass Filled | Gold | Liquid Crystal Polymer (LCP), Glass Filled | UL94 V-0 |
|
FA5S036HP1CONN FPC BOTTOM 36POS 0.5MM R/A JAE Electronics |
4,289 |
|
Datasheet |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | 36 | 0.020" (0.50mm) | Solder | 50V | 0.30mm | 0.057" (1.45mm) | Contacts, Bottom | Flip Lock | Tapered | Solder Retention, Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyamide (PA), Nylon, Glass Filled | Gold | Liquid Crystal Polymer (LCP), Glass Filled | UL94 V-0 |
|
FA5S045HP1CONN FPC BOTTOM 45POS 0.5MM R/A JAE Electronics |
3,705 |
|
Datasheet |
FA5 | Tray | Obsolete | FPC | Surface Mount, Right Angle | 45 | 0.020" (0.50mm) | Solder | 50V | 0.30mm | 0.057" (1.45mm) | Contacts, Bottom | Flip Lock | Tapered | Solder Retention, Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyamide (PA), Nylon, Glass Filled | Gold | Liquid Crystal Polymer (LCP), Glass Filled | UL94 V-0 |
|
FF02S40SV1CONN FPC BOTTOM 40POS 0.3MM R/A JAE Electronics |
3,657 |
|
Datasheet |
FF02S | Tray | Obsolete | FPC | Surface Mount, Right Angle | 40 | 0.012" (0.30mm) | Solder | 50V | 0.12mm | 0.035" (0.88mm) | Contacts, Bottom | Flip Lock | Straight | Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyphenylene Sulfide (PPS) | Gold | Liquid Crystal Polymer (LCP) | UL94 V-0 |
|
FF02S45SV1CONN FPC BOTTOM 45POS 0.3MM R/A JAE Electronics |
2,172 |
|
Datasheet |
FF02S | Strip | Obsolete | FPC | Surface Mount, Right Angle | 45 | 0.012" (0.30mm) | Solder | 50V | 0.12mm | 0.035" (0.88mm) | Contacts, Bottom | Flip Lock | Straight | Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyphenylene Sulfide (PPS) | Gold | Liquid Crystal Polymer (LCP) | UL94 V-0 |
|
FF02S50SV1CONN FPC BOTTOM 50POS 0.3MM R/A JAE Electronics |
3,888 |
|
Datasheet |
FF02S | Tray | Obsolete | FPC | Surface Mount, Right Angle | 50 | 0.012" (0.30mm) | Solder | 50V | 0.12mm | 0.035" (0.88mm) | Contacts, Bottom | Flip Lock | Straight | Zero Insertion Force (ZIF) | Copper Alloy | -40°C ~ 85°C | Polyphenylene Sulfide (PPS) | Gold | Liquid Crystal Polymer (LCP) | UL94 V-0 |