| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MFS2603AMBA0ADR2SAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
2,847 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | - | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MC33FS6520CAER2SYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
3,585 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MFS8601BMDA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
3,948 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 60V |
|
MC33FS8400G5ESSYSTEM BASIS CHIP FS8400 NXP USA Inc. |
2,440 |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC34PF8101A0EPR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
3,873 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 2.5V ~ 5.5V |
|
MC33FS4501NAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
2,138 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS4506CAER2SYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
3,077 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6517NAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
3,968 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
|
MFS8602BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
4,803 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) | 4.5V ~ 60V |
|
MC34PF3000A4EPIC POWER MANAGEMENT 48QFN NXP USA Inc. |
2,786 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | -40°C ~ 105°C | - | - | Surface Mount | 48-HVQFN (7x7) | 2.8V ~ 5.5V |