| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC35FS4506NAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
4,596 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS8415GJKSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
3,407 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 60V |
|
MC33FS8415GYKSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
4,072 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 60V |
|
MC33FS8415GYESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,138 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 60V |
|
MC33FS8415G0KSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,478 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 60V |
|
MC33FS8415G0ESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
3,974 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 60V |
|
MC33FS8415GJESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
4,434 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) | 60V |
|
MC33FS6507CAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
2,248 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6527LAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
4,942 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6528NAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
3,961 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |