| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Connector Type | Contact Type | Number of Positions | Number of Rows | Row Spacing - Mating | Insulation Height | Number of Positions Loaded | Style | Pitch - Mating | Shrouding | Mounting Style | Overall Contact Length | Termination | Contact Shape | Contact Length - Post | Fastening Type | Contact Length - Mating | Contact Finish - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TMMH-112-01-S-D-RA-EP2MM LOW PROFILE STRIPS Samtec Inc. |
3,539 |
|
- |
TMMH | Tube | Active | Header, Cuttable | Male Pin | 24 | 2 | 0.079" (2.00mm) | 0.250" (6.35mm) | All | Board to Board or Cable | 0.079" (2.00mm) | Unshrouded | Through Hole, Right Angle | - | Solder | Square | 0.092" (2.34mm) | Push-Pull | 0.126" (3.20mm) | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | End Shrouds, Mating Guide | - |
|
TMMH-112-01-S-D-RA-ES2MM LOW PROFILE STRIPS Samtec Inc. |
3,220 |
|
- |
TMMH | Tube | Active | Header, Cuttable | Male Pin | 24 | 2 | 0.079" (2.00mm) | 0.250" (6.35mm) | All | Board to Board or Cable | 0.079" (2.00mm) | Unshrouded | Through Hole, Right Angle | - | Solder | Square | 0.139" (3.53mm) | Push-Pull | 0.126" (3.20mm) | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | End Shrouds | - |
|
HMTSW-113-08-G-T-200-RACONN HEADER R/A 39POS 2.54MM Samtec Inc. |
3,485 |
|
Datasheet |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 39 | 3 | 0.100" (2.54mm) | 0.319" (8.10mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Unshrouded | Through Hole, Right Angle | - | Solder | Square | - | Push-Pull | 0.200" (5.08mm) | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A |
|
LTMM-107-01-S-D-SM-PCONN HEADER SMD 14POS 2MM Samtec Inc. |
2,763 |
|
- |
Flex Stack, LTMM | Tube | Active | Header | Male Pin | 14 | 2 | 0.079" (2.00mm) | 0.190" (4.83mm) | All | Board to Board | 0.079" (2.00mm) | Shrouded - 4 Wall | Surface Mount | - | Solder | Square | - | Push-Pull | 0.100" (2.54mm) | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot, Pick and Place | - |
|
TSS-115-04-S-D-RA-08CONN HEADER R/A 30POS 2.54MM Samtec Inc. |
4,365 |
|
Datasheet |
Flex Stack, TSS | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
HTSS-107-01-H-DCONN HEADER VERT 14POS 2.54MM Samtec Inc. |
2,530 |
|
- |
Flex Stack, HTSS | Bulk | Active | Header | Male Pin | 14 | 2 | 0.100" (2.54mm) | 0.350" (8.89mm) | All | Board to Board or Cable | 0.100" (2.54mm) | Shrouded - 4 Wall | Through Hole | 0.480" (12.19mm) | Solder | Square | 0.115" (2.92mm) | Push-Pull | 0.250" (6.35mm) | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | - |
|
IPT1-111-01-S-D-VSCONN HEADER SMD 22POS 2.54MM Samtec Inc. |
3,560 |
|
- |
Mini Mate® IPT1 | Tube | Active | Header | Male Pin | 22 | 2 | 0.100" (2.54mm) | 0.250" (6.35mm) | All | Board to Board | 0.100" (2.54mm) | Shrouded - 4 Wall | Surface Mount | - | Solder | Square | - | Push-Pull | 0.155" (3.94mm) | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 2.3A per Contact |
|
TST-109-04-H-D-RACONN HEADER R/A 18POS 2.54MM Samtec Inc. |
2,208 |
|
- |
Flex Stack, TST | Tube | Active | Header | Male Pin | 18 | 2 | 0.100" (2.54mm) | 0.365" (9.27mm) | All | Board to Cable/Wire | 0.100" (2.54mm) | Shrouded - 4 Wall | Through Hole, Right Angle | - | Solder | Square | 0.130" (3.30mm) | Push-Pull | 0.250" (6.35mm) | Gold | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | 3.4A per Contact |
|
T2M-110-01-S-D-SM-WT-KCONN HEADER SMD 20POS 2MM Samtec Inc. |
4,364 |
|
- |
Tiger Eye™ T2M | Bulk | Active | Header | Male Pin | 20 | 2 | 0.079" (2.00mm) | 0.228" (5.80mm) | All | Board to Board or Cable | 0.079" (2.00mm) | Shrouded - 4 Wall | Surface Mount | - | Solder | Square | - | Push-Pull | - | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Pick and Place, Solder Retention | 3.8A |
|
HFWJ-19-04-T-S-RA.156" HIGH-TEMP POWER TERMINAL S Samtec Inc. |
4,190 |
|
Datasheet |
HFWJ | Bulk | Active | Header | Male Pin | 19 | 1 | - | 0.250" (6.35mm) | All | Board to Board | 0.156" (3.96mm) | Unshrouded | Through Hole, Right Angle | - | Solder | Square | 0.156" (3.96mm) | Push-Pull | - | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 6.7A per contact |