| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Connector Type | Contact Type | Number of Positions | Number of Positions Loaded | Pitch - Mating | Contact Length - Post | Number of Rows | Row Spacing - Mating | Style | Mounting Style | Termination | Insulation Height | Fastening Type | Operating Temperature | Insulation Color | Contact Finish - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Mated Stacking Heights | Ingress Protection | Features | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SQT-107-02-H-6CONN RCPT 42POS 0.079 GOLD PCB Samtec Inc. |
2,259 |
|
- |
SQT | Tube | Active | Receptacle | Forked | 42 | All | 0.079" (2.00mm) | 0.600" (15.24mm) | 6 | 0.079" (2.00mm) | Board to Board or Cable | Through Hole | Solder | 0.250" (6.35mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 50.0µin (1.27µm) | UL94 V-0 | - | - | - | 5.1A per Contact |
|
SQT-128-03-S-DCONN RCPT 56POS 0.079 GOLD PCB Samtec Inc. |
2,487 |
|
- |
SQT | Tube | Active | Receptacle | Forked | 56 | All | 0.079" (2.00mm) | 0.208" (5.28mm) | 2 | 0.079" (2.00mm) | Board to Board or Cable | Through Hole | Solder | 0.250" (6.35mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | - | 5.1A per Contact |
|
YTE-103-02-G-Q-4702.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
3,657 |
|
Datasheet |
YTE | Bulk | Active | Elevated Socket | Forked | 12 | All | 0.079" (2.00mm) | - | 4 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.470" (11.94mm) | Push-Pull | -55°C ~ 105°C | Black | Gold | 20.0µin (0.51µm) | - | - | - | - | - |
|
CLP-111-02-STL-D-KLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
2,824 |
|
- |
CLP | - | Active | Receptacle | Female Socket | 22 | All | 0.050" (1.27mm) | - | 2 | 0.050" (1.27mm) | Board to Board | Surface Mount | Solder | 0.084" (2.14mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | Pick and Place | 3.3A per Contact |
|
BCS-140-F-D-DECONN RCPT 80POS 0.1 GOLD PCB Samtec Inc. |
4,659 |
|
Datasheet |
Tiger Claw™ BCS | Bulk | Active | Receptacle, Bottom or Top Entry | Female Socket | 80 | All | 0.100" (2.54mm) | 0.120" (3.05mm) | 2 | 0.100" (2.54mm) | Board to Board | Through Hole | Solder | 0.290" (7.37mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 3.00µin (0.076µm) | UL94 V-0 | - | - | - | 4.6A per Contact |
|
SSW-140-22-G-D-RACONN RCPT 80POS 0.1 GOLD PCB R/A Samtec Inc. |
4,623 |
|
- |
SSW | Bulk | Active | Receptacle | Forked | 80 | All | 0.100" (2.54mm) | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Board to Board or Cable | Through Hole, Right Angle | Solder | 0.195" (4.95mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 20.0µin (0.51µm) | UL94 V-0 | - | - | - | 4.7A per Contact |
|
SSW-150-22-G-D-RACONN RCPT 100P 0.1 GOLD PCB R/A Samtec Inc. |
4,140 |
|
- |
SSW | Bulk | Active | Receptacle | Forked | 100 | All | 0.100" (2.54mm) | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Board to Board or Cable | Through Hole, Right Angle | Solder | 0.195" (4.95mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 20.0µin (0.51µm) | UL94 V-0 | - | - | - | 4.7A per Contact |
|
SDL-119-G-32.100" LOW PROFILE DOUBLE ROW SCR Samtec Inc. |
4,832 |
|
Datasheet |
SDL | Tube | Active | Receptacle | Female Socket | 38 | All | 0.100" (2.54mm) | 0.125" (3.18mm) | 2 | 0.100" (2.54mm) | Board to Board | Through Hole | Solder | 0.050" (1.27mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | - | - | - | - | - |
|
SD-118-G-1A.100" DOUBLE ROW SCREW MACHINE S Samtec Inc. |
3,736 |
|
Datasheet |
SD | Tube | Active | Receptacle | Female Socket | 36 | All | 0.100" (2.54mm) | 0.360" (9.14mm) | 2 | 0.100" (2.54mm) | Board to Board | Through Hole | Solder | - | Push-Pull | -55°C ~ 125°C | Black | Gold | 10.0µin (0.25µm) | - | - | - | - | - |
|
SDL-124-T-39.100" LOW PROFILE DOUBLE ROW SCR Samtec Inc. |
2,186 |
|
Datasheet |
SDL | Tube | Active | Receptacle | Female Socket | 48 | All | 0.100" (2.54mm) | 0.110" (2.79mm) | 2 | 0.100" (2.54mm) | Board to Board | Through Hole | Solder | 0.050" (1.27mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | - | - | - | - | - |