| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Connector Type | Contact Type | Number of Positions | Number of Positions Loaded | Pitch - Mating | Contact Length - Post | Number of Rows | Row Spacing - Mating | Style | Mounting Style | Termination | Insulation Height | Fastening Type | Operating Temperature | Insulation Color | Contact Finish - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Mated Stacking Heights | Ingress Protection | Features | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FLE-168-01-G-DVCONN RCPT 136POS 0.05 GOLD SMD Samtec Inc. |
4,342 |
|
Datasheet |
FLE | Bulk | Active | Receptacle | Female Socket | 136 | All | 0.050" (1.27mm) | - | 2 | 0.050" (1.27mm) | Board to Board or Cable | Surface Mount | Solder | 0.172" (4.37mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 10.0µin (0.25µm) | - | - | - | - | 2A per Contact |
|
MMS-140-02-S-DV-A-KCONN RCPT 80POS 0.079 GOLD SMD Samtec Inc. |
3,220 |
|
- |
MMS | Tube | Active | Receptacle | Female Socket | 80 | All | 0.079" (2.00mm) | - | 2 | 0.079" (2.00mm) | Board to Board or Cable | Surface Mount | Solder | 0.177" (4.50mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | - | - | - | Board Guide, Pick and Place | 3.9A per Contact |
|
SSQ-133-04-G-TCONN RCPT 99POS 0.1 GOLD PCB Samtec Inc. |
4,074 |
|
Datasheet |
SSQ | Bulk | Active | Receptacle | Forked | 99 | All | 0.100" (2.54mm) | 0.584" (14.83mm) | 3 | 0.100" (2.54mm) | Board to Board or Cable | Through Hole | Solder | 0.335" (8.51mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 20.0µin (0.51µm) | UL94 V-0 | - | - | - | - |
|
YTE-114-02-L-Q-7902.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
2,707 |
|
Datasheet |
YTE | Bulk | Active | Elevated Socket | Forked | 56 | All | 0.079" (2.00mm) | - | 4 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.790" (20.07mm) | Push-Pull | -55°C ~ 105°C | Black | Gold | 10.0µin (0.25µm) | - | - | - | - | - |
|
CLP-111-02-H-D-A-PLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
2,316 |
|
- |
CLP | - | Active | Receptacle | Female Socket | 22 | All | 0.050" (1.27mm) | - | 2 | 0.050" (1.27mm) | Board to Board | Surface Mount | Solder | 0.084" (2.14mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | Board Guide, Pick and Place | 3.3A per Contact |
|
ESQ-132-37-H-DCONN SOCKET 64POS 0.1 GOLD PCB Samtec Inc. |
3,519 |
|
Datasheet |
ESQ | Tube | Active | Elevated Socket | Forked | 64 | All | 0.100" (2.54mm) | 0.090" (2.29mm) | 2 | 0.100" (2.54mm) | Board to Board | Through Hole | Solder | 0.435" (11.05mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | - | 5.7A per Contact |
|
SQT-131-01-L-QCONN RCPT 124POS 0.079 GOLD PCB Samtec Inc. |
3,575 |
|
- |
SQT | Tube | Active | Receptacle | Forked | 124 | All | 0.079" (2.00mm) | 0.090" (2.29mm) | 4 | 0.079" (2.00mm) | Board to Board or Cable | Through Hole | Solder | 0.250" (6.35mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 10.0µin (0.25µm) | UL94 V-0 | - | - | - | 5.1A per Contact |
|
CLP-116-02-H-D-ALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
4,072 |
|
- |
CLP | - | Active | Receptacle | Female Socket | 32 | All | 0.050" (1.27mm) | - | 2 | 0.050" (1.27mm) | Board to Board | Surface Mount | Solder | 0.084" (2.14mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | Board Guide | 3.3A per Contact |
|
SQT-147-01-F-T-RACONN RCPT 141P 0.079 GOLD PCB RA Samtec Inc. |
4,102 |
|
- |
SQT | Tube | Active | Receptacle | Forked | 141 | All | 0.079" (2.00mm) | 0.090" (2.29mm) | 3 | 0.079" (2.00mm) | Board to Board or Cable | Through Hole, Right Angle | Solder | 0.236" (6.00mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | Flash | UL94 V-0 | - | - | - | 5.1A per Contact |
|
SD-125-G-21C.100" DOUBLE ROW SCREW MACHINE S Samtec Inc. |
4,635 |
|
Datasheet |
SD | Tube | Active | Receptacle | Female Socket | 50 | All | 0.100" (2.54mm) | 0.260" (6.60mm) | 2 | 0.100" (2.54mm) | Board to Board | Through Hole | Solder | - | Push-Pull | -55°C ~ 125°C | Black | Gold | 10.0µin (0.25µm) | - | - | - | - | - |