| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Connector Type | Contact Type | Number of Positions | Number of Positions Loaded | Pitch - Mating | Contact Length - Post | Number of Rows | Row Spacing - Mating | Style | Mounting Style | Termination | Insulation Height | Fastening Type | Operating Temperature | Insulation Color | Contact Finish - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Mated Stacking Heights | Ingress Protection | Features | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
YTQ-122-03-H-Q-0502.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc. |
4,220 |
|
Datasheet |
YTQ | Tube | Active | Socket | Forked | 88 | 87 | 0.079" (2.00mm) | 0.208" (5.28mm) | 4 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.250" (6.35mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | - | - | - | - | - |
|
CLT-136-02-SM-D-BE-ALOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
4,941 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CLM-137-02-LM-D-BELOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc. |
4,042 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CLM-137-02-L-D-BELOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc. |
3,387 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CLT-148-02-S-D-BE-PLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
4,897 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
ESD-125-G-07CONN SOCKET 50POS 0.1 GOLD PCB Samtec Inc. |
4,577 |
|
Datasheet |
ESD | Bulk | Active | Elevated Socket | Female Socket | 50 | All | 0.100" (2.54mm) | 0.265" (6.73mm) | 2 | 0.100" (2.54mm) | Board to Board | Through Hole | Solder | 0.400" (10.16mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 10.0µin (0.25µm) | UL94 V-0 | - | - | - | - |
|
CLP-133-02-H-D-BE-PLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
4,253 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | 66 | All | 0.050" (1.27mm) | - | 2 | 0.050" (1.27mm) | Board to Board | Surface Mount | Solder | 0.084" (2.14mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | Pick and Place | 3.3A per Contact |
|
YTE-132-02-L-Q-500-0012.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
2,535 |
|
Datasheet |
YTE | Tube | Active | Elevated Socket | Forked | 128 | 127 | 0.079" (2.00mm) | - | 4 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.500" (12.70mm) | Push-Pull | -55°C ~ 105°C | Black | Gold | 10.0µin (0.25µm) | - | - | - | - | - |
|
CLT-131-02-H-D-ALOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
3,918 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
ESQT-136-03-G-Q-310CONN SOCKET 144P 0.079 GOLD PCB Samtec Inc. |
3,981 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | 144 | All | 0.079" (2.00mm) | 0.148" (3.76mm) | 4 | 0.079" (2.00mm) | Board to Board or Cable | Through Hole | Solder | 0.310" (7.87mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 20.0µin (0.51µm) | UL94 V-0 | - | - | - | 4.5A per Contact |