| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Connector Type | Contact Type | Number of Positions | Number of Positions Loaded | Pitch - Mating | Contact Length - Post | Number of Rows | Row Spacing - Mating | Style | Mounting Style | Termination | Insulation Height | Fastening Type | Operating Temperature | Insulation Color | Contact Finish - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Mated Stacking Heights | Ingress Protection | Features | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FOLC-150-01-SM-Q.050" FOURRAY QUAD ROW TIGER EYE Samtec Inc. |
2,432 |
|
Datasheet |
FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | 200 | All | 0.050" (1.27mm) | 0.075" (1.91mm) | 4 | 0.050" (1.27mm) | Board to Board | Through Hole | Solder | 0.180" (4.57mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | - | 2.6A per Contact |
|
QST-140-01-S-52.00 MM POWER PLANE SOCKET STRIP Samtec Inc. |
3,837 |
|
Datasheet |
QST | Tube | Active | Receptacle | Female Socket | 200 | All | 0.079" (2.00mm) | 0.212" (5.38mm) | 5 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.638" (16.20mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | - | - | - | - | - |
|
FOLC-150-01-S-Q-LCCONN RCPT 200POS 0.05 GOLD PCB Samtec Inc. |
3,919 |
|
- |
FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | 200 | All | 0.050" (1.27mm) | 0.075" (1.91mm) | 4 | 0.050" (1.27mm) | Board to Board | Through Hole | Solder | 0.180" (4.57mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | Board Lock | 2.6A per Contact |
|
FOLC-145-L2-S-Q-LCCONN RCPT 180POS 0.05 GOLD SMD Samtec Inc. |
4,672 |
|
- |
FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | 180 | All | 0.050" (1.27mm) | - | 4 | 0.050" (1.27mm) | Board to Board | Surface Mount | Solder | 0.178" (4.51mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | Board Lock | 2.6A per Contact |
|
YTE-146-02-G-Q-7002.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
3,100 |
|
Datasheet |
YTE | Tube | Active | Elevated Socket | Forked | 184 | All | 0.079" (2.00mm) | - | 4 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.700" (17.78mm) | Push-Pull | -55°C ~ 105°C | Black | Gold | 20.0µin (0.51µm) | - | - | - | - | - |
|
YTQ-150-03-S-62.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc. |
4,743 |
|
Datasheet |
YTQ | Tube | Active | Socket | Forked | 300 | All | 0.079" (2.00mm) | 0.208" (5.28mm) | 6 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.250" (6.35mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | - | - | - | - | - |
|
YTE-140-02-M-6-4952.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
4,820 |
|
Datasheet |
YTE | Tube | Active | Elevated Socket | Forked | 240 | All | 0.079" (2.00mm) | - | 6 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.495" (12.57mm) | Push-Pull | -55°C ~ 105°C | Black | Gold | 20.0µin (0.51µm) | - | - | - | - | - |
|
QST-130-02-G-52.00 MM POWER PLANE SOCKET STRIP Samtec Inc. |
4,868 |
|
Datasheet |
QST | Tube | Active | Receptacle | Female Socket | 150 | All | 0.079" (2.00mm) | 0.125" (3.18mm) | 5 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.500" (12.70mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 10.0µin (0.25µm) | - | - | - | - | - |
|
FOLC-140-M2-S-QCONN RCPT 160P 0.05 GOLD SMD T/H Samtec Inc. |
4,883 |
|
- |
FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | 160 | All | 0.050" (1.27mm) | 0.120" (3.05mm) | 4 | 0.050" (1.27mm) | Board to Board | Surface Mount, Through Hole | Solder | 0.185" (4.70mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | UL94 V-0 | - | - | - | 2.6A per Contact |
|
YTQ-150-02-S-52.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc. |
4,808 |
|
Datasheet |
YTQ | Tube | Active | Socket | Forked | 250 | All | 0.079" (2.00mm) | 0.600" (15.24mm) | 5 | 0.079" (2.00mm) | Board to Board | Through Hole | Solder | 0.250" (6.35mm) | Push-Pull | -55°C ~ 125°C | Black | Gold | 30.0µin (0.76µm) | - | - | - | - | - |