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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
05-0518-11HCONN SOCKET SIP 5POS GOLD |
3,877 |
|
Datasheet |
518 | Bulk | Active | SIP | 5 (1 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
13-0518-10CONN SOCKET SIP 13POS GOLD |
3,571 |
|
Datasheet |
518 | Bulk | Active | SIP | 13 (1 x 13) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
03-0508-30CONN SOCKET SIP 3POS GOLD |
4,222 |
|
Datasheet |
508 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
|
SIP1X27-014BSIP1X27-014B-SIP SOCKET 27 CTS |
2,398 |
|
Datasheet |
SIP1x | Bulk | Active | SIP | 27 (1 x 27) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
|
116-87-610-41-007101CONN IC DIP SOCKET 10POS GOLD |
3,327 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
110-83-312-41-105101CONN IC DIP SOCKET 12POS GOLD |
4,440 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
110-87-324-41-605101CONN IC DIP SOCKET 24POS GOLD |
4,218 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
110-87-324-41-005101CONN IC DIP SOCKET 24POS GOLD |
2,771 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
HLS-0102-G-12.100" SCREW MACHINE SOCKET ARRAY |
2,200 |
|
Datasheet |
HLS | Tube | Active | SIP | 2 (1 x 2) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
ARO 64-HZL/NEC-TSOCKET |
3,690 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
540-99-032-24-000000CONN SOCKET PLCC 32POS TIN-LEAD |
3,846 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin-Lead | 200.0µin (5.08µm) | - | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | - |
|
AR24-HZL/7/07-TTCONN IC DIP SOCKET 24POS GOLD |
3,161 |
|
- |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
ED044PLCZCONN SOCKET PLCC 44POS TIN |
2,266 |
|
Datasheet |
ED | Tube | Active | PLCC | 44 (2 x 22) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
|
A-ICS-254-08-TT50IC SOCKET, MACHINED PIN, 7.62MM, |
2,850 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Nickel | 78.7µin (2.00µm) | Beryllium Copper | Through Hole, Right Angle | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 78.7µin (2.00µm) | Brass |
|
D2614-42CONN IC DIP SOCKET 14POS GOLD |
2,452 |
|
Datasheet |
D26 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
|
AR 32 HGL-TTSOCKET |
4,709 |
|
- |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 32 | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Brass |
|
116-83-308-41-009101CONN IC DIP SOCKET 8POS GOLD |
2,186 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
10-2513-10TCONN IC DIP SOCKET 10POS GOLD |
3,808 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
09-0518-11CONN SOCKET SIP 9POS GOLD |
4,482 |
|
Datasheet |
518 | Bulk | Active | SIP | 9 (1 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
11-0518-10HCONN SOCKET SIP 11POS GOLD |
2,983 |
|
Datasheet |
518 | Bulk | Active | SIP | 11 (1 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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