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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-83-424-41-001101

    115-83-424-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,555
    RFQ

    -

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0204-TT-12

    HLS-0204-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,124
    RFQ
    HLS-0204-TT-12

    Datasheet

    HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    614-87-328-41-001101

    614-87-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,955
    RFQ
    614-87-328-41-001101

    Datasheet

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    12-3513-10

    12-3513-10

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,405
    RFQ
    12-3513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-0508-21

    02-0508-21

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,159
    RFQ
    02-0508-21

    Datasheet

    508 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    02-0508-31

    02-0508-31

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    3,579
    RFQ
    02-0508-31

    Datasheet

    508 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    02-1508-21

    02-1508-21

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    3,419
    RFQ
    02-1508-21

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    02-1508-31

    02-1508-31

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    4,357
    RFQ
    02-1508-31

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    ICF-308-F-O-TR

    ICF-308-F-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,525
    RFQ
    ICF-308-F-O-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    110-83-318-41-105161

    110-83-318-41-105161

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,558
    RFQ
    110-83-318-41-105161

    Datasheet

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-314-41-007101

    116-83-314-41-007101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,214
    RFQ
    116-83-314-41-007101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    3-822516-2

    3-822516-2

    CONN SOCKET PLCC 28POS TIN

    TE Connectivity AMP Connectors

    3,397
    RFQ
    3-822516-2

    Datasheet

    - Tape & Reel (TR) Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    500-032-000

    500-032-000

    CONN SOCKET SIP 32POS GOLD

    3M

    2,343
    RFQ

    -

    - - Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    ICF-308-F-I-TR

    ICF-308-F-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,525
    RFQ
    ICF-308-F-I-TR

    Datasheet

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    540-44-032-24-000000

    540-44-032-24-000000

    CONN SOCKET PLCC 32POS TIN

    Mill-Max Manufacturing Corp.

    3,598
    RFQ
    540-44-032-24-000000

    Datasheet

    540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    2-641612-2

    2-641612-2

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    2,414
    RFQ
    2-641612-2

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic -55°C ~ 125°C
    116-87-422-41-003101

    116-87-422-41-003101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,275
    RFQ
    116-87-422-41-003101

    Datasheet

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-641932-2

    2-641932-2

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    2,136
    RFQ
    2-641932-2

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic -55°C ~ 125°C
    110-83-624-41-005101

    110-83-624-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,857
    RFQ
    110-83-624-41-005101

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-624-41-605101

    110-83-624-41-605101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,872
    RFQ
    110-83-624-41-605101

    Datasheet

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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