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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 52-HZL/01-TTSOCKET |
4,598 |
|
- |
AR | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Brass |
|
BU220Z-178-HTCONN IC DIP SOCKET 22POS GOLD |
4,285 |
|
Datasheet |
BU-178HT | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Copper | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Brass |
|
AR 64-HZL-TTCONN IC DIP SOCKET 64POS TIN |
2,630 |
|
Datasheet |
- | Tray | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
ICF-314-TM-O.100" SURFACE MOUNT SCREW MACHIN |
4,298 |
|
Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
ICF-314-T-I.100" SURFACE MOUNT SCREW MACHIN |
2,598 |
|
Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
4620CONN TRANSIST TO-3 3POS TIN |
4,098 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Rectangular) | Tin | - | Brass | Chassis Mount | Closed Frame | - | Solder | - | - | Tin | Polyester, Glass Filled | - | Brass |
|
540-44-044-24-000000CONN SOCKET PLCC 44POS TIN |
4,694 |
|
Datasheet |
540 | Tube | Obsolete | PLCC | 44 (4 x 11) | Tin | 150.0µin (3.81µm) | Copper Alloy | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 150.0µin (3.81µm) | Copper Alloy |
|
|
06-6513-10HCONN IC DIP SOCKET 6POS GOLD |
3,176 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
11-0513-11CONN SOCKET SIP 11POS GOLD |
2,800 |
|
Datasheet |
0513 | Bulk | Active | SIP | 11 (1 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
23-0518-10TCONN SOCKET SIP 23POS GOLD |
2,471 |
|
Datasheet |
518 | Bulk | Active | SIP | 23 (1 x 23) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
212-1-16-003CONN IC DIP SOCKET 16POS GOLD |
4,959 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
|
|
HLS-0114-TT-2.100" SCREW MACHINE SOCKET ARRAY |
3,377 |
|
Datasheet |
HLS | Tube | Active | SIP | 14 (1 x 14) | Tin | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Tin | Thermoplastic | - | - |
|
|
614-87-432-41-001101CONN IC DIP SOCKET 32POS GOLD |
3,008 |
|
Datasheet |
614 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
299-87-310-11-001101CONN IC DIP SOCKET 10POS GOLD |
2,911 |
|
Datasheet |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
115-83-328-41-001101CONN IC DIP SOCKET 28POS GOLD |
3,533 |
|
- |
115 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
122-87-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
3,929 |
|
Datasheet |
122 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
123-87-422-41-001101CONN IC DIP SOCKET 22POS GOLD |
4,047 |
|
Datasheet |
123 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
APO-314-T-J.100" LOW PROFILE SCREW MACHINE |
3,449 |
|
Datasheet |
APO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
|
D0818-01CONN IC DIP SOCKET 18POS GOLD |
3,102 |
|
Datasheet |
D0 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
|
SMPX-68LCC-PSMT PLCC SOCKET 68P POLARISED RO |
3,166 |
|
Datasheet |
SMPX | Tube | Active | PLCC | 68 (4 x 17) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -50°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
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