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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-87-081-09-000101

    510-87-081-09-000101

    CONN SOCKET PGA 81POS GOLD

    Preci-Dip

    		 4,342
    RFQ
    		510-87-081-09-000101

    Datasheet

         		510 Bulk Active PGA 81 (9 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-069-11-061101

    510-87-069-11-061101

    CONN SOCKET PGA 69POS GOLD

    Preci-Dip

    		 3,679
    RFQ
    		510-87-069-11-061101

    Datasheet

         		510 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-83-316-41-002101

    124-83-316-41-002101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    		 3,372
    RFQ

    -

    		 124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-322-41-001101

    116-87-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    		 3,821
    RFQ
    		116-87-322-41-001101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1571541-2

    1571541-2

    CONN SOCKET PLCC 52POS TIN

    TE Connectivity AMP Connectors

    		 3,990
    RFQ
    		1571541-2

    Datasheet

         		PCS Bulk Obsolete PLCC 52 (4 x 13) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS) -
    HLS-0113-TT-11

    HLS-0113-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,486
    RFQ
    		HLS-0113-TT-11

    Datasheet

         		HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    110-83-628-41-105101

    110-83-628-41-105101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    		 3,459
    RFQ
    		110-83-628-41-105101

    Datasheet

         		110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    33-0518-10

    33-0518-10

    CONN SOCKET SIP 33POS GOLD

    Aries Electronics

    		 4,838
    RFQ
    		33-0518-10

    Datasheet

         		518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0508-20

    08-0508-20

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    		 2,813
    RFQ
    		08-0508-20

    Datasheet

         		508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    08-0508-30

    08-0508-30

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    		 3,552
    RFQ
    		08-0508-30

    Datasheet

         		508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    08-1508-20

    08-1508-20

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 4,320
    RFQ
    		08-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    08-1508-30

    08-1508-30

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 2,943
    RFQ
    		08-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    14-C280-10T

    14-C280-10T

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    		 2,756
    RFQ
    		14-C280-10T

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    146-87-324-41-035101

    146-87-324-41-035101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 2,953
    RFQ
    		146-87-324-41-035101

    Datasheet

         		146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-324-41-036101

    146-87-324-41-036101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 4,497
    RFQ
    		146-87-324-41-036101

    Datasheet

         		146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-320-41-002101

    116-83-320-41-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    		 2,622
    RFQ
    		116-83-320-41-002101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-NTT

    ICO-314-NTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,621
    RFQ
    		ICO-314-NTT

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    HLS-0107-G-2

    HLS-0107-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,238
    RFQ
    		HLS-0107-G-2

    Datasheet

         		HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICF-318-TM-O

    ICF-318-TM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 4,329
    RFQ
    		ICF-318-TM-O

    Datasheet

         		ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-318-T-I

    ICF-318-T-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 3,929
    RFQ
    		ICF-318-T-I

    Datasheet

         		ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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