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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HLS-1320-G-2.100" SCREW MACHINE SOCKET ARRAY Samtec Inc. |
2,610 |
|
Datasheet |
HLS | Bulk | Active | SIP | 260 (13 x 20) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
PLCC-044-F-NCONN SOCKET PLCC 44POS GOLD Samtec Inc. |
4,730 |
|
Datasheet |
PLCC | Tube | Obsolete | PLCC | 44 (4 x 11) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
PLCC-044-T-NCONN SOCKET PLCC 44POS TIN Samtec Inc. |
4,125 |
|
Datasheet |
PLCC | Tube | Obsolete | PLCC | 44 (4 x 11) | Tin | - | Beryllium Copper | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
PLCC-084-T-NCONN SOCKET PLCC 84POS TIN Samtec Inc. |
4,435 |
|
Datasheet |
PLCC | Tube | Obsolete | PLCC | 84 (4 x 21) | Tin | - | Beryllium Copper | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
IC-628-SGGCONN IC DIP SOCKET 28POS GOLD Samtec Inc. |
4,799 |
|
Datasheet |
IC | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Phosphor Bronze |
|
|
ICO-314-SST-LCONN IC DIP SOCKET 14POS GOLD Samtec Inc. |
2,688 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | - | Brass |
|
|
ICO-314-M-TTCONN IC DIP SOCKET 14POS TIN Samtec Inc. |
3,809 |
|
Datasheet |
ICO | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyester, Glass Filled | - | Brass |
|
|
APA-308-G-KADAPTER PLUG Samtec Inc. |
2,777 |
|
Datasheet |
APA | Bulk | Active | - | 8 (2 x 4) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 20.0µin (0.51µm) | Phosphor Bronze |
|
|
APA-322-G-KADAPTER PLUG Samtec Inc. |
3,692 |
|
Datasheet |
APA | Bulk | Active | - | 22 (2 x 11) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 20.0µin (0.51µm) | Phosphor Bronze |
|
|
APA-322-T-PADAPTER PLUG Samtec Inc. |
2,126 |
|
Datasheet |
APA | Bulk | Active | - | 22 (2 x 11) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
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