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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    04-0503-21

    04-0503-21

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    		 3,631
    RFQ
    		04-0503-21

    Datasheet

         		0503 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    28-0518-10T

    28-0518-10T

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    		 4,009
    RFQ
    		28-0518-10T

    Datasheet

         		518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-1518-10T

    28-1518-10T

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,151
    RFQ
    		28-1518-10T

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-3513-10T

    22-3513-10T

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 3,728
    RFQ
    		22-3513-10T

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0205-T-11

    HLS-0205-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,187
    RFQ
    		HLS-0205-T-11

    Datasheet

         		HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APO-308-T-T

    APO-308-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,752
    RFQ
    		APO-308-T-T

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    24-3518-11

    24-3518-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,197
    RFQ
    		24-3518-11

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-096-14-091101

    510-87-096-14-091101

    CONN SOCKET PGA 96POS GOLD

    Preci-Dip

    		 2,731
    RFQ
    		510-87-096-14-091101

    Datasheet

         		510 Bulk Active PGA 96 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-101-11-001101

    510-87-101-11-001101

    CONN SOCKET PGA 101POS GOLD

    Preci-Dip

    		 2,064
    RFQ
    		510-87-101-11-001101

    Datasheet

         		510 Bulk Active PGA 101 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-624-41-801101

    110-83-624-41-801101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    		 3,129
    RFQ
    		110-83-624-41-801101

    Datasheet

         		110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-088-13-062101

    510-87-088-13-062101

    CONN SOCKET PGA 88POS GOLD

    Preci-Dip

    		 4,452
    RFQ
    		510-87-088-13-062101

    Datasheet

         		510 Bulk Active PGA 88 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-088-13-081101

    510-87-088-13-081101

    CONN SOCKET PGA 88POS GOLD

    Preci-Dip

    		 4,873
    RFQ
    		510-87-088-13-081101

    Datasheet

         		510 Bulk Active PGA 88 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-632-41-036101

    146-87-632-41-036101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    		 3,008
    RFQ
    		146-87-632-41-036101

    Datasheet

         		146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0113-T-2

    HLS-0113-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,424
    RFQ
    		HLS-0113-T-2

    Datasheet

         		HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-83-632-41-018101

    116-83-632-41-018101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    		 2,093
    RFQ
    		116-83-632-41-018101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-6518-11

    24-6518-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,195
    RFQ
    		24-6518-11

    Datasheet

         		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0204-T-15

    HLS-0204-T-15

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,695
    RFQ
    		HLS-0204-T-15

    Datasheet

         		HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    116-87-328-41-001101

    116-87-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    		 3,892
    RFQ
    		116-87-328-41-001101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-308-NGT

    ICO-308-NGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,373
    RFQ
    		ICO-308-NGT

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-308-ZAGT

    ICO-308-ZAGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,189
    RFQ
    		ICO-308-ZAGT

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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