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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2485264-1DIP IC SOCKET 8P,GOLD FLASH TE Connectivity AMP Connectors |
4,766 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Gold | Flash | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Thermoplastic | 78.7µin (2.00µm) | Copper Alloy |
|
1-2199299-540P,DIP SKT,600 CL,LDR,PB FREE TE Connectivity AMP Connectors |
2,339 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 60.0µin (1.52µm) | Nickel |
|
|
2041549-1SOCKET ASSY, DMD 350, T/R, G/F TE Connectivity AMP Connectors |
442 |
|
Datasheet |
DMD | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 350 (35 x 36) | Gold | Flash | Copper Alloy | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin-Lead | Liquid Crystal Polymer (LCP), Glass Filled | - | Copper Alloy |
|
1-2324271-3RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
4,159 |
|
Datasheet |
- | Tray | Active | LGA 4189 | 2092 | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.034" (0.86mm) | -25°C ~ 100°C | Gold | Thermoplastic | 15.0µin (0.38µm) | Copper Alloy |
|
|
1-2324271-2LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
3,756 |
|
Datasheet |
- | Tray | Active | LGA 4189 | 2092 | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.034" (0.86mm) | -25°C ~ 100°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Copper Alloy |
|
|
1-2324271-1RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
215 |
|
Datasheet |
- | Tray | Active | LGA 4189 | 2092 | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.034" (0.86mm) | -25°C ~ 100°C | Gold | Thermoplastic | 30.0µin (0.76µm) | Copper Alloy |
|
|
2350616-1DUAL LGA,250 POS, DMD SOCKET TE Connectivity AMP Connectors |
296 |
|
Datasheet |
- | Tray | Active | LGA | 250 (16 x 25) | Gold | 3.00µin (0.076µm) | Copper Alloy | Surface Mount | Board Guide, Open Frame | 0.039" (1.00mm) | Solder | - | -25°C ~ 100°C | - | Thermoplastic | - | - |
|
|
1-2324271-4LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors |
121 |
|
Datasheet |
- | Tray | Active | LGA 4189 | 2092 | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.034" (0.86mm) | -25°C ~ 100°C | Gold | Thermoplastic | 15.0µin (0.38µm) | Copper Alloy |
|
2-2129710-5CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
171 |
|
Datasheet |
- | Tray | Last Time Buy | LGA | 3647 | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | - | Solder | - | - | - | Thermoplastic | - | Copper Alloy |
|
2-2129710-6CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors |
249 |
|
Datasheet |
- | Tray | Last Time Buy | LGA | 3647 | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | - | Solder | - | - | - | Thermoplastic | - | Copper Alloy |
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