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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1-1437504-0CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors |
2,320 |
|
Datasheet |
8060 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Beryllium Copper |
|
|
8080-1G9CONN TRANSIST TO-3 4POS GOLD TE Connectivity AMP Connectors |
4,615 |
|
Datasheet |
8080 | Bulk | Active | Transistor, TO-3 | 4 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Fluoropolymer (FP) | - | Beryllium Copper |
|
|
1825088-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
2,162 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | Thermoplastic | - | Brass |
|
|
8080-1G1-LFCONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors |
4,062 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polytetrafluoroethylene (PTFE) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
2-822114-4CONN SOCKET PQFP 160POS TIN-LEAD TE Connectivity AMP Connectors |
4,965 |
|
Datasheet |
- | Tube | Obsolete | QFP | 160 (4 x 40) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin-Lead | Liquid Crystal Polymer (LCP) | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
2-822064-5CONN SOCKET PQFP 132POS TIN-LEAD TE Connectivity AMP Connectors |
3,651 |
|
Datasheet |
- | Tube | Obsolete | QFP | 132 (4 x 33) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.025" (0.64mm) | Solder | 0.025" (0.64mm) | - | Tin-Lead | Liquid Crystal Polymer (LCP) | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
2-821949-5CONN SOCKET PQFP 132POS TIN-LEAD TE Connectivity AMP Connectors |
4,734 |
|
Datasheet |
- | Tube | Obsolete | QFP | 132 (4 x 33) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin-Lead | Liquid Crystal Polymer (LCP) | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
1871554-1CONN SKT 1207-F RIGHT LEVER SMD TE Connectivity AMP Connectors |
5 |
|
- |
- | Bulk | Obsolete | LGA | 1207 (33 x 34) | Gold | - | Copper Alloy | Surface Mount | Closed Frame | 0.043" (1.09mm) | Solder | 0.043" (1.09mm) | - | Gold | Thermoplastic | - | Copper Alloy |
|
|
1437522-4CONN SOCKET PGA 321POS GOLD TE Connectivity AMP Connectors |
4,789 |
|
Datasheet |
- | Bulk | Active | PGA | 321 (19 x 19) | Gold | 10.0µin (0.25µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Thermoplastic, Polyester | - | Copper Alloy |
|
|
2-640357-4CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
4,826 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
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