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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
8058-1G45CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors |
2,194 |
|
Datasheet |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Brass |
|
|
8058-1G59CONN TRANSIST TO-5 3POS GOLD TE Connectivity AMP Connectors |
4,292 |
|
Datasheet |
8058 | Bulk | Active | Transistor, TO-5 | 3 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Brass |
|
|
5-6437504-0CONN TRANSIST TO-3 3POS SILVER TE Connectivity AMP Connectors |
3,873 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Silver | - | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Silver | Diallyl Phthalate (DAP) | - | Beryllium Copper |
|
|
1-1747890-2CONN SOCKET LGA 771POS GOLD TE Connectivity AMP Connectors |
4,493 |
|
Datasheet |
- | Tray | Obsolete | LGA | 771 (33 x 33) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | 0.043" (1.09mm) | Solder | 0.043" (1.09mm) | -25°C ~ 100°C | - | Thermoplastic | - | - |
|
|
1939416-1CONN SOCKET LGA 1207POS GOLD TE Connectivity AMP Connectors |
2,684 |
|
Datasheet |
- | Tray | Active | LGA | 1207 (33 x 34) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | 0.043" (1.09mm) | Solder | 0.043" (1.09mm) | -55°C ~ 110°C | - | Thermoplastic | - | - |
|
|
516-AG7DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
4,928 |
|
- |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester | - | Copper Alloy |
|
|
1939416-2CONN SOCKET LGA 1207POS GOLD TE Connectivity AMP Connectors |
2,586 |
|
Datasheet |
- | Tray | Active | LGA | 1207 (33 x 34) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | 0.043" (1.09mm) | Solder | 0.043" (1.09mm) | -55°C ~ 110°C | - | Thermoplastic | - | - |
|
|
2-641262-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
2,150 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 30.0µin (0.76µm) | Phosphor Bronze |
|
|
1-1437538-3CONN IC DIP SOCKET 28POS TINLEAD TE Connectivity AMP Connectors |
3,991 |
|
Datasheet |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
1554116-2CONN SOCKET LGA 1356POS GOLD TE Connectivity AMP Connectors |
2,503 |
|
Datasheet |
- | Tray | Obsolete | LGA | 1356 (32 x 41) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | 0.040" (1.02mm) | Solder | 0.040" (1.01mm) | -25°C ~ 100°C | Gold | Thermoplastic | 15.0µin (0.38µm) | Copper Alloy |
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