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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    510-83-066-11-002101

    510-83-066-11-002101

    CONN SOCKET PGA 66POS GOLD

    Preci-Dip

    2,077
    RFQ
    510-83-066-11-002101

    Datasheet

    510 Bulk Active PGA 66 (11 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    123-83-328-41-001101

    123-83-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,486
    RFQ
    123-83-328-41-001101

    Datasheet

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    2-1571586-5

    2-1571586-5

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    2,196
    RFQ
    2-1571586-5

    Datasheet

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 25.0µin (0.63µm) Copper
    28-6518-11

    28-6518-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,524
    RFQ
    28-6518-11

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    AR32-HZW/T-R

    AR32-HZW/T-R

    CONN IC DIP SOCKET 32POS TIN

    Assmann WSW Components

    2,030
    RFQ
    AR32-HZW/T-R

    Datasheet

    - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Beryllium Copper
    14-3501-20

    14-3501-20

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,582
    RFQ
    14-3501-20

    Datasheet

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    14-3501-30

    14-3501-30

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,818
    RFQ
    14-3501-30

    Datasheet

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7250-10

    02-7250-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,345
    RFQ
    02-7250-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7350-10

    02-7350-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,270
    RFQ
    02-7350-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7400-10

    02-7400-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    4,316
    RFQ
    02-7400-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7420-10

    02-7420-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,767
    RFQ
    02-7420-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7425-10

    02-7425-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,889
    RFQ
    02-7425-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7450-10

    02-7450-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,143
    RFQ
    02-7450-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7520-10

    02-7520-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    2,050
    RFQ
    02-7520-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7540-10

    02-7540-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    4,824
    RFQ
    02-7540-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7625-10

    02-7625-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,966
    RFQ
    02-7625-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    02-7920-10

    02-7920-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    3,357
    RFQ
    02-7920-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    116-83-636-41-018101

    116-83-636-41-018101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    2,890
    RFQ
    116-83-636-41-018101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    32-0518-10T

    32-0518-10T

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    2,380
    RFQ
    32-0518-10T

    Datasheet

    518 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    116-83-328-41-008101

    116-83-328-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,230
    RFQ
    116-83-328-41-008101

    Datasheet

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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