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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-83-066-11-002101

    510-83-066-11-002101

    CONN SOCKET PGA 66POS GOLD

    Preci-Dip

    		 2,077
    RFQ
    		510-83-066-11-002101

    Datasheet

         		510 Bulk Active PGA 66 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-328-41-001101

    123-83-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    		 4,486
    RFQ
    		123-83-328-41-001101

    Datasheet

         		123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-1571586-5

    2-1571586-5

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    		 2,196
    RFQ
    		2-1571586-5

    Datasheet

         		800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    28-6518-11

    28-6518-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,524
    RFQ
    		28-6518-11

    Datasheet

         		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    AR32-HZW/T-R

    AR32-HZW/T-R

    CONN IC DIP SOCKET 32POS TIN

    Assmann WSW Components

    		 2,030
    RFQ
    		AR32-HZW/T-R

    Datasheet

         		- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
    14-3501-20

    14-3501-20

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    		 3,582
    RFQ
    		14-3501-20

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3501-30

    14-3501-30

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    		 3,818
    RFQ
    		14-3501-30

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    02-7250-10

    02-7250-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 3,345
    RFQ
    		02-7250-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7350-10

    02-7350-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 3,270
    RFQ
    		02-7350-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7400-10

    02-7400-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 4,316
    RFQ
    		02-7400-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7420-10

    02-7420-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 3,767
    RFQ
    		02-7420-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7425-10

    02-7425-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 3,889
    RFQ
    		02-7425-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7450-10

    02-7450-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 3,143
    RFQ
    		02-7450-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7520-10

    02-7520-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 2,050
    RFQ
    		02-7520-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7540-10

    02-7540-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 4,824
    RFQ
    		02-7540-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7625-10

    02-7625-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 3,966
    RFQ
    		02-7625-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    02-7920-10

    02-7920-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 3,357
    RFQ
    		02-7920-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-636-41-018101

    116-83-636-41-018101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    		 2,890
    RFQ
    		116-83-636-41-018101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-0518-10T

    32-0518-10T

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 2,380
    RFQ
    		32-0518-10T

    Datasheet

         		518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-328-41-008101

    116-83-328-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    		 4,230
    RFQ
    		116-83-328-41-008101

    Datasheet

         		116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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