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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    16-3503-20

    16-3503-20

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,353
    RFQ
    16-3503-20

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7425-10

    04-7425-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    3,928
    RFQ
    04-7425-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-7545-10

    04-7545-10

    CONN SOCKET SIP 4POS TIN

    Aries Electronics

    3,697
    RFQ
    04-7545-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    27-0518-11H

    27-0518-11H

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    4,702
    RFQ
    27-0518-11H

    Datasheet

    518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-3513-10H

    22-3513-10H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,417
    RFQ
    22-3513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3518-10E

    20-3518-10E

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,484
    RFQ
    20-3518-10E

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-0501-30

    12-0501-30

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    4,388
    RFQ
    12-0501-30

    Datasheet

    501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-6501-30

    18-6501-30

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    3,236
    RFQ
    18-6501-30

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-6513-10H

    20-6513-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,018
    RFQ
    20-6513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-4820-90C

    10-4820-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,381
    RFQ
    10-4820-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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