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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    30-6501-20

    30-6501-20

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    2,557
    RFQ
    30-6501-20

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-6501-30

    30-6501-30

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    2,834
    RFQ
    30-6501-30

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    01-0518-00

    01-0518-00

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    4,499
    RFQ
    01-0518-00

    Datasheet

    518 Bulk Active SIP 1 (1 x 1) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    36-0518-11H

    36-0518-11H

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    2,992
    RFQ
    36-0518-11H

    Datasheet

    518 Bulk Active SIP 36 (1 x 36) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    36-1518-11H

    36-1518-11H

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,462
    RFQ
    36-1518-11H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    16-C195-00

    16-C195-00

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,338
    RFQ
    16-C195-00

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-C280-00

    16-C280-00

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,302
    RFQ
    16-C280-00

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    12-7350-10

    12-7350-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    4,253
    RFQ
    12-7350-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    12-7435-10

    12-7435-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    3,379
    RFQ
    12-7435-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    12-7500-10

    12-7500-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    2,138
    RFQ
    12-7500-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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