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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    25-0517-90C

    25-0517-90C

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 2,910
    RFQ
    		25-0517-90C

    Datasheet

         		0517 Bulk Active SIP 25 (1 x 25) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-0501-21

    10-0501-21

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    		 2,386
    RFQ
    		10-0501-21

    Datasheet

         		501 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-0501-31

    10-0501-31

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    		 3,367
    RFQ
    		10-0501-31

    Datasheet

         		501 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-3503-21

    08-3503-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 4,301
    RFQ
    		08-3503-21

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    29-0518-11H

    29-0518-11H

    CONN SOCKET SIP 29POS GOLD

    Aries Electronics

    		 4,420
    RFQ
    		29-0518-11H

    Datasheet

         		518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-3501-31

    18-3501-31

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 3,581
    RFQ
    		18-3501-31

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-6511-11

    16-6511-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,971
    RFQ
    		16-6511-11

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-6503-20

    20-6503-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,215
    RFQ
    		20-6503-20

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-6503-30

    20-6503-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,999
    RFQ
    		20-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    23-0508-20

    23-0508-20

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    		 2,347
    RFQ
    		23-0508-20

    Datasheet

         		508 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
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