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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    25-0517-90C

    25-0517-90C

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 2,910
    RFQ
    		25-0517-90C

    Datasheet

         		0517 Bulk Active SIP 25 (1 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    10-0501-21

    10-0501-21

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    		 2,386
    RFQ
    		10-0501-21

    Datasheet

         		501 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    10-0501-31

    10-0501-31

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    		 3,367
    RFQ
    		10-0501-31

    Datasheet

         		501 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    08-3503-21

    08-3503-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 4,301
    RFQ
    		08-3503-21

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    29-0518-11H

    29-0518-11H

    CONN SOCKET SIP 29POS GOLD

    Aries Electronics

    		 4,420
    RFQ
    		29-0518-11H

    Datasheet

         		518 Bulk Active SIP 29 (1 x 29) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    18-3501-31

    18-3501-31

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 3,581
    RFQ
    		18-3501-31

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    16-6511-11

    16-6511-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,971
    RFQ
    		16-6511-11

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    20-6503-20

    20-6503-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,215
    RFQ
    		20-6503-20

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-6503-30

    20-6503-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,999
    RFQ
    		20-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    23-0508-20

    23-0508-20

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    		 2,347
    RFQ
    		23-0508-20

    Datasheet

         		508 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
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