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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    30-0508-30

    30-0508-30

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    2,388
    RFQ
    30-0508-30

    Datasheet

    508 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    30-1508-20

    30-1508-20

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,451
    RFQ
    30-1508-20

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    30-1508-30

    30-1508-30

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,090
    RFQ
    30-1508-30

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    16-3508-202

    16-3508-202

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,097
    RFQ
    16-3508-202

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-3508-302

    16-3508-302

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,215
    RFQ
    16-3508-302

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    20-820-90T

    20-820-90T

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    4,785
    RFQ
    20-820-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    14-8385-610C

    14-8385-610C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,276
    RFQ
    14-8385-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    19-0503-20

    19-0503-20

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    2,482
    RFQ
    19-0503-20

    Datasheet

    0503 Bulk Active SIP 19 (1 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
    19-0503-30

    19-0503-30

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    3,471
    RFQ
    19-0503-30

    Datasheet

    0503 Bulk Active SIP 19 (1 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
    24-C182-00

    24-C182-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,061
    RFQ
    24-C182-00

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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