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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    16-C195-30

    16-C195-30

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,437
    RFQ
    16-C195-30

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-C280-30

    16-C280-30

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,520
    RFQ
    16-C280-30

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    24-3508-202

    24-3508-202

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,288
    RFQ
    24-3508-202

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    24-3508-302

    24-3508-302

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,881
    RFQ
    24-3508-302

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    24-6508-302

    24-6508-302

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,543
    RFQ
    24-6508-302

    Datasheet

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    17-0501-31

    17-0501-31

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    4,502
    RFQ
    17-0501-31

    Datasheet

    501 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    24-0501-20

    24-0501-20

    CONN SOCKET SIP 24POS TIN

    Aries Electronics

    4,126
    RFQ
    24-0501-20

    Datasheet

    501 Bulk Active SIP 24 (1 x 24) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    24-0501-30

    24-0501-30

    CONN SOCKET SIP 24POS TIN

    Aries Electronics

    2,124
    RFQ
    24-0501-30

    Datasheet

    501 Bulk Active SIP 24 (1 x 24) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    16-3503-21

    16-3503-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,245
    RFQ
    16-3503-21

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    16-3503-31

    16-3503-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,852
    RFQ
    16-3503-31

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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