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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    26-0501-30

    26-0501-30

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    		 3,195
    RFQ
    		26-0501-30

    Datasheet

         		501 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-3513-11H

    40-3513-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,114
    RFQ
    		40-3513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    3883-312-10-32

    3883-312-10-32

    SER 6556 UNIV TEST SCKT RECEP

    Aries Electronics

    		 2,257
    RFQ
    		3883-312-10-32

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    16-0511-11

    16-0511-11

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    		 4,165
    RFQ
    		16-0511-11

    Datasheet

         		511 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    25-7350-10

    25-7350-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 3,488
    RFQ
    		25-7350-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7390-10

    25-7390-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 2,080
    RFQ
    		25-7390-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7435-10

    25-7435-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 3,938
    RFQ
    		25-7435-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7450-10

    25-7450-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 2,446
    RFQ
    		25-7450-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7500-10

    25-7500-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 4,420
    RFQ
    		25-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7590-10

    25-7590-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 3,758
    RFQ
    		25-7590-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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