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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
26-0501-30CONN SOCKET SIP 26POS TIN Aries Electronics |
3,195 |
|
Datasheet |
501 | Bulk | Active | SIP | 26 (1 x 26) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
40-3513-11HCONN IC DIP SOCKET 40POS GOLD Aries Electronics |
4,114 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
3883-312-10-32SER 6556 UNIV TEST SCKT RECEP Aries Electronics |
2,257 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
16-0511-11CONN SOCKET SIP 16POS GOLD Aries Electronics |
4,165 |
|
Datasheet |
511 | Bulk | Active | SIP | 16 (1 x 16) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
25-7350-10CONN SOCKET SIP 25POS TIN Aries Electronics |
3,488 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
25-7390-10CONN SOCKET SIP 25POS TIN Aries Electronics |
2,080 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
25-7435-10CONN SOCKET SIP 25POS TIN Aries Electronics |
3,938 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
25-7450-10CONN SOCKET SIP 25POS TIN Aries Electronics |
2,446 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
25-7500-10CONN SOCKET SIP 25POS TIN Aries Electronics |
4,420 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
25-7590-10CONN SOCKET SIP 25POS TIN Aries Electronics |
3,758 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
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