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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    48-6573-10

    48-6573-10

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,674
    RFQ
    		48-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    48-6575-10

    48-6575-10

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 2,910
    RFQ
    		48-6575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    32-0508-21

    32-0508-21

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 4,531
    RFQ
    		32-0508-21

    Datasheet

         		508 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    32-0508-31

    32-0508-31

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 2,923
    RFQ
    		32-0508-31

    Datasheet

         		508 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    32-1508-21

    32-1508-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,531
    RFQ
    		32-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    32-1508-31

    32-1508-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,727
    RFQ
    		32-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    24-3508-212

    24-3508-212

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,045
    RFQ
    		24-3508-212

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    48-6556-11

    48-6556-11

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 4,040
    RFQ
    		48-6556-11

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
    24-6508-212

    24-6508-212

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,394
    RFQ
    		24-6508-212

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-6508-312

    24-6508-312

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,692
    RFQ
    		24-6508-312

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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