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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    24-C300-31

    24-C300-31

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,798
    RFQ
    		24-C300-31

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    32-3552-11

    32-3552-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 2,500
    RFQ
    		32-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    32-6503-21

    32-6503-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,485
    RFQ
    		32-6503-21

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    32-6503-31

    32-6503-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,923
    RFQ
    		32-6503-31

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    22-4508-21

    22-4508-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 4,043
    RFQ
    		22-4508-21

    Datasheet

         		508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    22-4508-31

    22-4508-31

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 3,009
    RFQ
    		22-4508-31

    Datasheet

         		508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    30-9503-21

    30-9503-21

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 2,641
    RFQ
    		30-9503-21

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    30-9503-31

    30-9503-31

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 3,647
    RFQ
    		30-9503-31

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    84-PGM11010-40

    84-PGM11010-40

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 2,044
    RFQ
    		84-PGM11010-40

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    32-3503-21

    32-3503-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,095
    RFQ
    		32-3503-21

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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