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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    37-0508-31

    37-0508-31

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    3,056
    RFQ
    37-0508-31

    Datasheet

    508 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    32-9503-21

    32-9503-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,489
    RFQ
    32-9503-21

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    32-9503-31

    32-9503-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,307
    RFQ
    32-9503-31

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    36-0511-11

    36-0511-11

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    2,107
    RFQ
    36-0511-11

    Datasheet

    511 Bulk Active SIP 36 (1 x 36) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    144-PGM15025-10

    144-PGM15025-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,757
    RFQ
    144-PGM15025-10

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-3575-11

    28-3575-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    4,867
    RFQ
    28-3575-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    28-6575-11

    28-6575-11

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    2,061
    RFQ
    28-6575-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    34-3503-21

    34-3503-21

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,403
    RFQ
    34-3503-21

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    34-3503-31

    34-3503-31

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    2,333
    RFQ
    34-3503-31

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    64-9503-20

    64-9503-20

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    4,567
    RFQ
    64-9503-20

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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