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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    39-0511-11

    39-0511-11

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    		 2,104
    RFQ
    		39-0511-11

    Datasheet

         		511 Bulk Active SIP 39 (1 x 39) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    40-1508-21

    40-1508-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,573
    RFQ
    		40-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    40-1508-31

    40-1508-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,551
    RFQ
    		40-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    32-C182-21

    32-C182-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,039
    RFQ
    		32-C182-21

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    32-C182-31

    32-C182-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,539
    RFQ
    		32-C182-31

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    32-C212-31

    32-C212-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,583
    RFQ
    		32-C212-31

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    32-C300-21

    32-C300-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,293
    RFQ
    		32-C300-21

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    32-C300-31

    32-C300-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,715
    RFQ
    		32-C300-31

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    42-3551-11

    42-3551-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 4,341
    RFQ
    		42-3551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    42-3552-11

    42-3552-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 2,614
    RFQ
    		42-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
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