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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    32-6552-16

    32-6552-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 2,939
    RFQ
    		32-6552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    32-6553-16

    32-6553-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 2,995
    RFQ
    		32-6553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 250°C Nickel Boron Polyetheretherketone (PEEK), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    32-3554-16

    32-3554-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 4,160
    RFQ
    		32-3554-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    42-6556-40

    42-6556-40

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    		 4,376
    RFQ
    		42-6556-40

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder Cup 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    144-PGM12001-41

    144-PGM12001-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,240
    RFQ
    		144-PGM12001-41

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    28-536-11

    28-536-11

    CONN SOCKET PLCC ZIF 28POS GOLD

    Aries Electronics

    		 2,152
    RFQ

    -

    		 536 - Obsolete PLCC, ZIF (ZIP) 28 (4 x 7) Gold 12.0µin (0.30µm) - Through Hole Open Frame 0.050" (1.27mm) - - - - - - -
    144-PGM12001-51

    144-PGM12001-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,281
    RFQ
    		144-PGM12001-51

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    32-6574-16

    32-6574-16

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 2,736
    RFQ
    		32-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    28-3551-16

    28-3551-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    		 4,639
    RFQ
    		28-3551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    28-3553-16

    28-3553-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    		 3,983
    RFQ
    		28-3553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
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