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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    121-PGM13012-10T

    121-PGM13012-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    4,853
    RFQ
    121-PGM13012-10T

    Datasheet

    PGM Bulk Active PGA - Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    65-PRS11037-12

    65-PRS11037-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,906
    RFQ
    65-PRS11037-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    66-PLS11049-12

    66-PLS11049-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,973
    RFQ
    66-PLS11049-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    66-PRS11054-12

    66-PRS11054-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,144
    RFQ
    66-PRS11054-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    68-PRS11033-12

    68-PRS11033-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,591
    RFQ

    -

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    48-3570-16

    48-3570-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    4,541
    RFQ
    48-3570-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    48-3571-16

    48-3571-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    3,932
    RFQ
    48-3571-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    48-3572-16

    48-3572-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    4,035
    RFQ
    48-3572-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    48-3573-16

    48-3573-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    3,378
    RFQ
    48-3573-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    48-3575-16

    48-3575-16

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    2,787
    RFQ
    48-3575-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
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