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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    32-6575-18

    32-6575-18

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,191
    RFQ
    32-6575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    180-PLS18007-12

    180-PLS18007-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,096
    RFQ
    180-PLS18007-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    181-PLS18041-12

    181-PLS18041-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,906
    RFQ
    181-PLS18041-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    181-PRS18040-12

    181-PRS18040-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,240
    RFQ
    181-PRS18040-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    181-PRS18041-12

    181-PRS18041-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,480
    RFQ
    181-PRS18041-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    40-6554-18

    40-6554-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    4,683
    RFQ
    40-6554-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 250°C Nickel Boron Polyetheretherketone (PEEK), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    40-3554-18

    40-3554-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    4,971
    RFQ

    -

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 250°C Nickel Boron Polyetheretherketone (PEEK), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    196-PRS14001-16

    196-PRS14001-16

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,807
    RFQ
    196-PRS14001-16

    Datasheet

    PRS Bulk Obsolete PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 200°C Nickel Bronze Polyphenylene Sulfide (PPS) 50.0µin (1.27µm) Beryllium Copper
    281-PRS19010-12

    281-PRS19010-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,126
    RFQ
    281-PRS19010-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    281-PLS19029-12

    281-PLS19029-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,205
    RFQ
    281-PLS19029-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
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