| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
32-6575-18CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics |
2,191 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
180-PLS18007-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,096 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
181-PLS18041-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
4,906 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
181-PRS18040-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
4,240 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
181-PRS18041-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
4,480 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
40-6554-18CONN IC DIP SOCKET ZIF 40POS Aries Electronics |
4,683 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
40-3554-18CONN IC DIP SOCKET ZIF 40POS Aries Electronics |
4,971 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
196-PRS14001-16CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,807 |
|
Datasheet |
PRS | Bulk | Obsolete | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 200°C | Nickel Bronze | Polyphenylene Sulfide (PPS) | 50.0µin (1.27µm) | Beryllium Copper |
|
281-PRS19010-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,126 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
281-PLS19029-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,205 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |