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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    10-0508-20

    10-0508-20

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    		 2,674
    RFQ
    		10-0508-20

    Datasheet

         		508 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    10-0508-30

    10-0508-30

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    		 4,608
    RFQ
    		10-0508-30

    Datasheet

         		508 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    10-1508-20

    10-1508-20

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,016
    RFQ
    		10-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    10-1508-30

    10-1508-30

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,255
    RFQ
    		10-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    16-3518-101

    16-3518-101

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,227
    RFQ
    		16-3518-101

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    11-0517-90C

    11-0517-90C

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    		 3,371
    RFQ
    		11-0517-90C

    Datasheet

         		0517 Bulk Active SIP 11 (1 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-6511-10

    16-6511-10

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    		 4,048
    RFQ
    		16-6511-10

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    25-0518-10H

    25-0518-10H

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 2,539
    RFQ
    		25-0518-10H

    Datasheet

         		518 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    30-1518-10

    30-1518-10

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 2,574
    RFQ
    		30-1518-10

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-3513-10T

    28-3513-10T

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,251
    RFQ
    		28-3513-10T

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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