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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    16-3518-10M

    16-3518-10M

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,901
    RFQ
    16-3518-10M

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    10-6501-20

    10-6501-20

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    3,092
    RFQ
    10-6501-20

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    10-6501-30

    10-6501-30

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    4,440
    RFQ
    10-6501-30

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    14-8770-10WR

    14-8770-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,706
    RFQ
    14-8770-10WR

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    14-8870-10WR

    14-8870-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,801
    RFQ
    14-8870-10WR

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    25-0518-11

    25-0518-11

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    4,883
    RFQ
    25-0518-11

    Datasheet

    518 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    31-0518-10H

    31-0518-10H

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    2,399
    RFQ
    31-0518-10H

    Datasheet

    518 Bulk Active SIP 31 (1 x 31) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    C8128-04

    C8128-04

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    4,002
    RFQ
    C8128-04

    Datasheet

    Edge-Grip™, C81 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    12-6513-11H

    12-6513-11H

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,292
    RFQ
    12-6513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    18-0518-00

    18-0518-00

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,018
    RFQ
    18-0518-00

    Datasheet

    518 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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