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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A14-LCGCONN IC DIP SOCKET 14POS GOLD Assmann WSW Components |
4,874 |
|
- |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | - | 0.100" (2.54mm) | - | Gold | - | - | - |
|
AR 08 HGL-TTSOCKET Assmann WSW Components |
2,979 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Brass |
|
|
AW 127-13/Z-TSOCKET 13 CONTACTS SINGLE ROW Assmann WSW Components |
2,793 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
A 28-LC/7-TCONN IC DIP SOCKET 28POS TIN Assmann WSW Components |
2,700 |
|
Datasheet |
- | Box | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | 60.0µin (1.52µm) | Phosphor Bronze |
|
|
AW 127-14/Z-TSOCKET 14 CONTACTS SINGLE ROW Assmann WSW Components |
3,737 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
AR06-HZL/07-TTCONN IC DIP SOCKET 6POS GOLD Assmann WSW Components |
2,069 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
|
A16-LCGCONN IC DIP SOCKET 16POS GOLD Assmann WSW Components |
3,240 |
|
- |
- | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | - | 0.100" (2.54mm) | - | Gold | - | - | - |
|
AR08-HZL/01-TTCONN IC DIP SOCKET 8POS GOLD Assmann WSW Components |
3,733 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AR16-HZL-TTCONN IC DIP SOCKET 16POS TIN Assmann WSW Components |
3,737 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
A48-LC-TRCONN IC DIP SOCKET 48POS TIN Assmann WSW Components |
3,146 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
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