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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PGA168H003B1-1706RPGA SOCKET 168 CTS |
3,501 |
|
Datasheet |
- | - | Active | PGA | 168 (17 x 17) | Gold | 30.0µin (0.76µm) | - | Through Hole | Open Frame | 0.100" (2.54mm) | - | - | - | - | - | - | - |
|
|
116-83-628-41-004101CONN IC DIP SOCKET 28POS GOLD |
4,682 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
ICO-318-ZNGT.100" LOW PROFILE SCREW MACHINE |
4,907 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
APA-316-G-JADAPTER PLUG |
2,486 |
|
Datasheet |
APA | Tube | Active | - | 16 (2 x 8) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 20.0µin (0.51µm) | Phosphor Bronze |
|
|
116-83-652-41-003101CONN IC DIP SOCKET 52POS GOLD |
4,714 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
714-43-117-31-018000CONN SOCKET SIP 17POS GOLD |
2,108 |
|
Datasheet |
714 | Bulk | Active | SIP | 17 (1 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
|
50-9513-10TCONN IC DIP SOCKET 50POS GOLD |
3,401 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
09-0508-21CONN SOCKET SIP 9POS GOLD |
2,681 |
|
Datasheet |
508 | Bulk | Active | SIP | 9 (1 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
09-0508-31CONN SOCKET SIP 9POS GOLD |
4,203 |
|
Datasheet |
508 | Bulk | Active | SIP | 9 (1 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
10-2822-90CCONN IC DIP SOCKET 10POS GOLD |
4,972 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
50-9518-10TCONN IC DIP SOCKET 50POS GOLD |
4,247 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
28-3518-10MCONN IC DIP SOCKET 28POS GOLD |
4,320 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
612-83-950-41-001101CONN IC DIP SOCKET 50POS GOLD |
3,859 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
33-0518-00CONN SOCKET SIP 33POS GOLD |
4,334 |
|
Datasheet |
518 | Bulk | Active | SIP | 33 (1 x 33) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
ICO-314-ZCGT.100" LOW PROFILE SCREW MACHINE |
2,090 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
ICF-632-SM-O-TR.100" SURFACE MOUNT SCREW MACHIN |
4,455 |
|
Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
HLS-0209-G-2.100" SCREW MACHINE SOCKET ARRAY |
2,000 |
|
Datasheet |
HLS | Tube | Active | SIP | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
1-1437508-7CONN SOCKET TRANSIST TO-5 8POS |
3,637 |
|
Datasheet |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Brass |
|
|
48-6513-10CONN IC DIP SOCKET 48POS GOLD |
4,186 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
24-3513-10HCONN IC DIP SOCKET 24POS GOLD |
2,017 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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