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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    510-83-149-15-064101

    510-83-149-15-064101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    		 3,547
    RFQ
    		510-83-149-15-064101

    Datasheet

         		510 Bulk Active PGA 149 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    15-0501-30

    15-0501-30

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 3,179
    RFQ
    		15-0501-30

    Datasheet

         		501 Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    22-6503-20

    22-6503-20

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 3,257
    RFQ
    		22-6503-20

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    22-6503-30

    22-6503-30

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 4,747
    RFQ
    		22-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    32-C212-10H

    32-C212-10H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,961
    RFQ
    		32-C212-10H

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    116-83-652-41-001101

    116-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    		 4,566
    RFQ
    		116-83-652-41-001101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    APA-316-T -N

    APA-316-T -N

    .100" SCREW MACHINE DIP ADAPTOR

    Samtec Inc.

    		 2,945
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    510-83-145-17-001101

    510-83-145-17-001101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    		 2,029
    RFQ
    		510-83-145-17-001101

    Datasheet

         		510 Bulk Active PGA 145 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    30-6513-11H

    30-6513-11H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 2,310
    RFQ
    		30-6513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    APO-628-G-J

    APO-628-G-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,463
    RFQ
    		APO-628-G-J

    Datasheet

         		APO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    20-6511-11

    20-6511-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,385
    RFQ
    		20-6511-11

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    APO-316-G-A1

    APO-316-G-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,537
    RFQ
    		APO-316-G-A1

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    ICF-648-TL-I

    ICF-648-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 3,529
    RFQ
    		ICF-648-TL-I

    Datasheet

         		ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    HLS-0708-TT-2

    HLS-0708-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,035
    RFQ
    		HLS-0708-TT-2

    Datasheet

         		HLS Bulk Active SIP 56 (7 x 8) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
    ICA-628-ZWGT-3

    ICA-628-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,590
    RFQ
    		ICA-628-ZWGT-3

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    HLS-0114-G-12

    HLS-0114-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,842
    RFQ
    		HLS-0114-G-12

    Datasheet

         		HLS Tube Active SIP 14 (1 x 14) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    ICA-318-ZWGG

    ICA-318-ZWGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,440
    RFQ
    		ICA-318-ZWGG

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    10-9503-21

    10-9503-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,676
    RFQ
    		10-9503-21

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    10-9503-31

    10-9503-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,057
    RFQ
    		10-9503-31

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    26-1508-20

    26-1508-20

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 2,260
    RFQ
    		26-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
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