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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    ICO-632-ZMGT

    ICO-632-ZMGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,464
    RFQ
    		ICO-632-ZMGT

    Datasheet

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    510-83-172-16-001101

    510-83-172-16-001101

    CONN SOCKET PGA 172POS GOLD

    Preci-Dip

    		 2,228
    RFQ
    		510-83-172-16-001101

    Datasheet

         		510 Bulk Active PGA 172 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-83-156-15-061101

    510-83-156-15-061101

    CONN SOCKET PGA 156POS GOLD

    Preci-Dip

    		 4,752
    RFQ
    		510-83-156-15-061101

    Datasheet

         		510 Bulk Active PGA 156 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-83-156-15-062101

    510-83-156-15-062101

    CONN SOCKET PGA 156POS GOLD

    Preci-Dip

    		 3,073
    RFQ
    		510-83-156-15-062101

    Datasheet

         		510 Bulk Active PGA 156 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    HLS-0218-T-22

    HLS-0218-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,112
    RFQ
    		HLS-0218-T-22

    Datasheet

         		HLS Tube Active SIP 36 (2 x 18) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    14-0508-21

    14-0508-21

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    		 2,341
    RFQ
    		14-0508-21

    Datasheet

         		508 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    14-0508-31

    14-0508-31

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    		 3,370
    RFQ
    		14-0508-31

    Datasheet

         		508 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    27-0508-20

    27-0508-20

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    		 4,827
    RFQ
    		27-0508-20

    Datasheet

         		508 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    27-0508-30

    27-0508-30

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    		 3,024
    RFQ
    		27-0508-30

    Datasheet

         		508 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    20-3508-201

    20-3508-201

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,639
    RFQ
    		20-3508-201

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    20-3508-301

    20-3508-301

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,122
    RFQ
    		20-3508-301

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    21-0508-30

    21-0508-30

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    		 2,693
    RFQ
    		21-0508-30

    Datasheet

         		508 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    APO-624-T-R

    APO-624-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,098
    RFQ
    		APO-624-T-R

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    APO-324-T-R

    APO-324-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,415
    RFQ
    		APO-324-T-R

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    24-3503-20

    24-3503-20

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 2,778
    RFQ
    		24-3503-20

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    14-1508-21

    14-1508-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,646
    RFQ
    		14-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    14-1508-31

    14-1508-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 3,896
    RFQ
    		14-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    116-83-650-41-011101

    116-83-650-41-011101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 3,542
    RFQ
    		116-83-650-41-011101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    11-0501-20

    11-0501-20

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    		 4,021
    RFQ
    		11-0501-20

    Datasheet

         		501 Bulk Active SIP 11 (1 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    11-0501-30

    11-0501-30

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    		 4,477
    RFQ
    		11-0501-30

    Datasheet

         		501 Bulk Active SIP 11 (1 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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