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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APO-308-G-B

    APO-308-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,101
    RFQ
    		APO-308-G-B

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    25-0508-20

    25-0508-20

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 2,157
    RFQ
    		25-0508-20

    Datasheet

         		508 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    25-0508-30

    25-0508-30

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 2,481
    RFQ
    		25-0508-30

    Datasheet

         		508 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    40-3513-11

    40-3513-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,935
    RFQ
    		40-3513-11

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    22-4508-20

    22-4508-20

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 4,229
    RFQ
    		22-4508-20

    Datasheet

         		508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    22-4508-30

    22-4508-30

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 4,339
    RFQ
    		22-4508-30

    Datasheet

         		508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-6810-90C

    14-6810-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,006
    RFQ
    		14-6810-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    836-AG11D

    836-AG11D

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    		 2,016
    RFQ
    		836-AG11D

    Datasheet

         		800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
    115-41-306-41-001000

    115-41-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,065
    RFQ
    		115-41-306-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    115-91-306-41-001000

    115-91-306-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    		 2,275
    RFQ
    		115-91-306-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    32-6518-11H

    32-6518-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,183
    RFQ
    		32-6518-11H

    Datasheet

         		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    550-10-056-09-041101

    550-10-056-09-041101

    PGA SOLDER TAIL

    Preci-Dip

    		 4,087
    RFQ
    		550-10-056-09-041101

    Datasheet

         		550 Bulk Active PGA 56 (9 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
    40-C182-11

    40-C182-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,886
    RFQ
    		40-C182-11

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-C212-11

    40-C212-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,172
    RFQ
    		40-C212-11

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-C300-11

    40-C300-11

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,201
    RFQ
    		40-C300-11

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-6513-10H

    40-6513-10H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,491
    RFQ
    		40-6513-10H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    ICA-628-WGT

    ICA-628-WGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,852
    RFQ
    		ICA-628-WGT

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    APH-0512-T-H

    APH-0512-T-H

    APH-0512-T-H

    Samtec Inc.

    		 3,785
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1512-T-H

    APH-1512-T-H

    APH-1512-T-H

    Samtec Inc.

    		 2,371
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0612-T-H

    APH-0612-T-H

    APH-0612-T-H

    Samtec Inc.

    		 4,500
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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