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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    20-7810-10

    20-7810-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 3,272
    RFQ
    		20-7810-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-7820-10

    20-7820-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 3,074
    RFQ
    		20-7820-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-7825-10

    20-7825-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 3,554
    RFQ
    		20-7825-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-7850-10

    20-7850-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 3,549
    RFQ
    		20-7850-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-7875-10

    20-7875-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 2,079
    RFQ
    		20-7875-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-7903-10

    20-7903-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 3,753
    RFQ
    		20-7903-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-7905-10

    20-7905-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 4,526
    RFQ
    		20-7905-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-7906-10

    20-7906-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 3,371
    RFQ
    		20-7906-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    317-91-102-41-005000

    317-91-102-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    		 4,277
    RFQ
    		317-91-102-41-005000

    Datasheet

         		317 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    114-41-306-41-117000

    114-41-306-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,271
    RFQ
    		114-41-306-41-117000

    Datasheet

         		114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    114-91-306-41-117000

    114-91-306-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,527
    RFQ
    		114-91-306-41-117000

    Datasheet

         		114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    17-71140-10

    17-71140-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    		 4,821
    RFQ
    		17-71140-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    17-71250-10

    17-71250-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    		 2,519
    RFQ
    		17-71250-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    17-7465-10

    17-7465-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    		 2,137
    RFQ
    		17-7465-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    17-7490-10

    17-7490-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    		 4,129
    RFQ
    		17-7490-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    17-7500-10

    17-7500-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    		 3,231
    RFQ
    		17-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    17-7650-10

    17-7650-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    		 4,772
    RFQ
    		17-7650-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    17-7750-10

    17-7750-10

    CONN SOCKET SIP 17POS TIN

    Aries Electronics

    		 3,161
    RFQ
    		17-7750-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    16-810-90WR

    16-810-90WR

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,493
    RFQ
    		16-810-90WR

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    115-43-304-61-001000

    115-43-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,983
    RFQ

    -

    		 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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