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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    110-91-210-41-105000

    110-91-210-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,481
    RFQ
    110-91-210-41-105000

    Datasheet

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-91-310-41-105000

    110-91-310-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,252
    RFQ
    110-91-310-41-105000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0217-T-30

    HLS-0217-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,815
    RFQ
    HLS-0217-T-30

    Datasheet

    HLS Tube Active SIP 34 (2 x 17) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    116-87-648-41-013101

    116-87-648-41-013101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,324
    RFQ
    116-87-648-41-013101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    ICO-322-JGG

    ICO-322-JGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,173
    RFQ
    ICO-322-JGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    17-0503-21

    17-0503-21

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,891
    RFQ
    17-0503-21

    Datasheet

    0503 Bulk Active SIP 17 (1 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    17-0503-31

    17-0503-31

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,938
    RFQ
    17-0503-31

    Datasheet

    0503 Bulk Active SIP 17 (1 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    20-6823-90

    20-6823-90

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,019
    RFQ
    20-6823-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    ICA-316-ZHGG

    ICA-316-ZHGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,279
    RFQ
    ICA-316-ZHGG

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    110-41-308-41-605000

    110-41-308-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,337
    RFQ
    110-41-308-41-605000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-91-308-41-605000

    110-91-308-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,850
    RFQ
    110-91-308-41-605000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    346-93-143-41-013000

    346-93-143-41-013000

    CONN SOCKET SIP 43POS GOLD

    Mill-Max Manufacturing Corp.

    2,237
    RFQ
    346-93-143-41-013000

    Datasheet

    346 Bulk Active SIP 43 (1 x 43) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    346-43-143-41-013000

    346-43-143-41-013000

    CONN SOCKET SIP 43POS GOLD

    Mill-Max Manufacturing Corp.

    3,640
    RFQ
    346-43-143-41-013000

    Datasheet

    346 Bulk Active SIP 43 (1 x 43) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    111-41-308-41-001000

    111-41-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,485
    RFQ
    111-41-308-41-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    111-91-308-41-001000

    111-91-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,507
    RFQ
    111-91-308-41-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    16-6501-31

    16-6501-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,078
    RFQ
    16-6501-31

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    40-6501-30

    40-6501-30

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    4,868
    RFQ

    -

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-6501-20

    40-6501-20

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    4,104
    RFQ
    40-6501-20

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    115-91-306-41-003000

    115-91-306-41-003000

    SOCKET IC OPEN LOWPRO .300 6POS

    Mill-Max Manufacturing Corp.

    3,919
    RFQ

    -

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Thermoplastic 200.0µin (5.08µm) Brass Alloy
    115-41-306-41-003000

    115-41-306-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,283
    RFQ
    115-41-306-41-003000

    Datasheet

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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