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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
8080-1G24CONN SOCKET TRANSIST TO-3 3POS |
380 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Round) | Tin-Lead | 20.0µin (0.51µm) | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin-Lead | Diallyl Phthalate (DAP) | 20.0µin (0.51µm) | Beryllium Copper |
|
2013620-3CONN SOCKET PGA ZIF 989POS GOLD |
4,670 |
|
Datasheet |
- | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.039" (1.00mm) | - | - | Thermoplastic | - | Copper Alloy |
|
|
ICO-324-MGT100" LOW PROFILE SCREW MACHINE D |
3,435 |
|
- |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
ICA-324-SGG.100" SCREW MACHINE DIP SOCKET |
4,164 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
123-43-624-41-801000CONN IC DIP SOCKET 24POS GOLD |
167 |
|
Datasheet |
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
ICO-316-NGG.100" LOW PROFILE SCREW MACHINE |
2,516 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
|
9-1437504-0CONN TRANSIST TO-3 3POS TIN |
4,092 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polytetrafluoroethylene (PTFE) | 200.0µin (5.08µm) | Beryllium Copper |
|
8059-2G9CONN TRANSIST TO-5 10POS GOLD |
4,907 |
|
Datasheet |
8059 | Bulk | Obsolete | Transistor, TO-5 | 10 (Round) | Gold | - | Copper Alloy | Through Hole | - | - | Solder | - | -55°C ~ 125°C | Gold | Polyamide (PA), Nylon, Glass Filled | - | Copper Alloy |
|
|
ICF-324-S-O.100" SURFACE MOUNT SCREW MACHIN |
4,258 |
|
- |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
ICF-624-S-O.100" SURFACE MOUNT SCREW MACHIN |
4,569 |
|
Datasheet |
ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
ICO-628-MGTCONN IC DIP SOCKET 28POS GOLD |
2,071 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
ICF-624-S-O-TR.100" SURFACE MOUNT SCREW MACHIN |
3,650 |
|
Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
ICA-324-ZAGT.100" SCREW MACHINE DIP SOCKET |
4,038 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
ICO-628-SGG.100" LOW PROFILE SCREW MACHINE |
4,237 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
|
8080-1G14CONN SOCKET TRANSIST TO-3 3POS |
4,072 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin-Lead | Phenolic | - | Beryllium Copper |
|
|
3-1437504-23-1437504-2 |
130 |
|
Datasheet |
8080 | Box | Active | Transistor, TO-3 | 3 (Oval) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin-Lead | Phenolic | - | Beryllium Copper |
|
|
ICO-320-NGG.100" LOW PROFILE SCREW MACHINE |
2,649 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
117-43-668-41-005000CONN IC DIP SOCKET 68POS GOLD |
198 |
|
Datasheet |
117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 68 (2 x 34) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
2040540-1CONN SOCKET LGA 1156POS GOLD |
2,030 |
|
Datasheet |
- | Tray | Active | LGA | 1156 (34 x 34) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | 0.036" (0.91mm) | Solder | 0.039" (1.00mm) | - | - | Thermoplastic | - | Copper Alloy |
|
|
ICF-628-S-O.100" SURFACE MOUNT SCREW MACHIN |
3,206 |
|
Datasheet |
ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
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