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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    16-3503-31

    16-3503-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,852
    RFQ
    16-3503-31

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    30-3503-20

    30-3503-20

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,526
    RFQ
    30-3503-20

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-3503-30

    30-3503-30

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,074
    RFQ
    30-3503-30

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    210-11-310-41-001000

    210-11-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,794
    RFQ
    210-11-310-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    116-93-306-41-007000

    116-93-306-41-007000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    4,747
    RFQ
    116-93-306-41-007000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-306-41-007000

    116-43-306-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,351
    RFQ
    116-43-306-41-007000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0317-T-2

    HLS-0317-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,515
    RFQ
    HLS-0317-T-2

    Datasheet

    HLS Tube Active SIP 51 (3 x 17) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    546-83-085-11-002135

    546-83-085-11-002135

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    3,524
    RFQ
    546-83-085-11-002135

    Datasheet

    546 Bulk Active PGA 85 (11 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
    546-83-085-11-002136

    546-83-085-11-002136

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    2,072
    RFQ
    546-83-085-11-002136

    Datasheet

    546 Bulk Active PGA 85 (11 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
    20-810-90TWR

    20-810-90TWR

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    3,790
    RFQ
    20-810-90TWR

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    146-41-308-41-012000

    146-41-308-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    4,734
    RFQ
    146-41-308-41-012000

    Datasheet

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    146-91-308-41-012000

    146-91-308-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    4,297
    RFQ
    146-91-308-41-012000

    Datasheet

    146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    104-13-306-41-770000

    104-13-306-41-770000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,283
    RFQ
    104-13-306-41-770000

    Datasheet

    104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
    110-43-210-41-001000

    110-43-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,529
    RFQ
    110-43-210-41-001000

    Datasheet

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    ICA-320-ZWGG-2

    ICA-320-ZWGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,793
    RFQ
    ICA-320-ZWGG-2

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    ICF-328-STL-I

    ICF-328-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,379
    RFQ
    ICF-328-STL-I

    Datasheet

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    ICF-628-STL-O

    ICF-628-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,517
    RFQ
    ICF-628-STL-O

    Datasheet

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    ICF-648-TL-O

    ICF-648-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,446
    RFQ
    ICF-648-TL-O

    Datasheet

    ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    APH-0918-T-T

    APH-0918-T-T

    APH-0918-T-T

    Samtec Inc.

    2,682
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1018-T-T

    APH-1018-T-T

    APH-1018-T-T

    Samtec Inc.

    4,073
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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