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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APO-324-G-A

    APO-324-G-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,603
    RFQ
    		APO-324-G-A

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-0508-G-R

    APH-0508-G-R

    APH-0508-G-R

    Samtec Inc.

    		 4,815
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1308-G-R

    APH-1308-G-R

    APH-1308-G-R

    Samtec Inc.

    		 2,264
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1208-G-R

    APH-1208-G-R

    APH-1208-G-R

    Samtec Inc.

    		 3,877
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0908-G-R

    APH-0908-G-R

    APH-0908-G-R

    Samtec Inc.

    		 4,593
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1408-G-R

    APH-1408-G-R

    APH-1408-G-R

    Samtec Inc.

    		 3,334
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1708-G-R

    APH-1708-G-R

    APH-1708-G-R

    Samtec Inc.

    		 3,890
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0708-G-R

    APH-0708-G-R

    APH-0708-G-R

    Samtec Inc.

    		 4,448
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    510-83-241-19-101101

    510-83-241-19-101101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    		 2,570
    RFQ
    		510-83-241-19-101101

    Datasheet

         		510 Bulk Active PGA 241 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-1508-21

    20-1508-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,509
    RFQ
    		20-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    20-1508-31

    20-1508-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,835
    RFQ
    		20-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    116-47-316-41-007000

    116-47-316-41-007000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 2,643
    RFQ
    		116-47-316-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-114-41-005000

    317-93-114-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    		 2,712
    RFQ
    		317-93-114-41-005000

    Datasheet

         		317 Bulk Active SIP 14 (1 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-318-41-003000

    116-41-318-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,633
    RFQ
    		116-41-318-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-318-41-003000

    116-91-318-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,028
    RFQ
    		116-91-318-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-320-G-M

    APA-320-G-M

    ADAPTER PLUG

    Samtec Inc.

    		 3,245
    RFQ
    		APA-320-G-M

    Datasheet

         		APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    410-91-224-10-001000

    410-91-224-10-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 2,137
    RFQ
    		410-91-224-10-001000

    Datasheet

         		410 Tube Active Zig-Zag, Left Stackable 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    410-91-224-10-002000

    410-91-224-10-002000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 4,954
    RFQ
    		410-91-224-10-002000

    Datasheet

         		410 Tube Active Zig-Zag, Right Stackable 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-320-41-003000

    116-41-320-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,355
    RFQ
    		116-41-320-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-420-41-003000

    116-41-420-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,912
    RFQ
    		116-41-420-41-003000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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