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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    110-93-428-41-105000

    110-93-428-41-105000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    3,252
    RFQ
    110-93-428-41-105000

    Datasheet

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-93-628-41-105000

    110-93-628-41-105000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,163
    RFQ
    110-93-628-41-105000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-428-41-105000

    110-43-428-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,063
    RFQ
    110-43-428-41-105000

    Datasheet

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-628-41-105000

    110-43-628-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,826
    RFQ
    110-43-628-41-105000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    APH-0922-T-R

    APH-0922-T-R

    APH-0922-T-R

    Samtec Inc.

    3,938
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1922-T-R

    APH-1922-T-R

    APH-1922-T-R

    Samtec Inc.

    3,213
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0222-T-R

    APH-0222-T-R

    APH-0222-T-R

    Samtec Inc.

    2,252
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1722-T-R

    APH-1722-T-R

    APH-1722-T-R

    Samtec Inc.

    2,621
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    116-93-316-41-008000

    116-93-316-41-008000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    4,350
    RFQ
    116-93-316-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-316-41-008000

    116-43-316-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,886
    RFQ
    116-43-316-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-2020-T-22

    HLS-2020-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,380
    RFQ
    HLS-2020-T-22

    Datasheet

    HLS Bulk Active SIP 400 (20 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    111-47-650-41-001000

    111-47-650-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,244
    RFQ
    111-47-650-41-001000

    Datasheet

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    317-43-119-41-005000

    317-43-119-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    3,075
    RFQ
    317-43-119-41-005000

    Datasheet

    317 Bulk Active SIP 19 (1 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-41-316-41-001000

    612-41-316-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,647
    RFQ
    612-41-316-41-001000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-91-316-41-001000

    612-91-316-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,010
    RFQ
    612-91-316-41-001000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-93-632-41-605000

    110-93-632-41-605000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    4,109
    RFQ
    110-93-632-41-605000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-632-41-605000

    110-43-632-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,515
    RFQ
    110-43-632-41-605000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    32-6551-10

    32-6551-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,247
    RFQ
    32-6551-10

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-3554-10

    32-3554-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,690
    RFQ
    32-3554-10

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    44-6556-10

    44-6556-10

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    3,708
    RFQ
    44-6556-10

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
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