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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    290-1294-00-3302J

    290-1294-00-3302J

    CONN IC DIP SOCKET ZIF 90POS GLD

    3M

    2,292
    RFQ
    290-1294-00-3302J

    Datasheet

    Textool™ Bulk Active DIP, ZIF (ZIP) 90 (2 x 45) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    7010321946

    7010321946

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    4,039
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    249-930X-XX-2401

    249-930X-XX-2401

    CONN SOCKET BGA 49POS GOLD

    3M

    2,627
    RFQ

    -

    Textool™ - Obsolete BGA 49 (Verification Required) 0.039" (1.00mm) Gold - - Through Hole Closed Frame - - - - - - -
    1011-1-0144-0B-00

    1011-1-0144-0B-00

    TEXTOOL1011-1-0144-0B-00

    3M

    3,678
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    1017-2-0256-0B-03

    1017-2-0256-0B-03

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    4,452
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    2196-9026-01-2401

    2196-9026-01-2401

    TEXTOOL 2196-9026-01-2401 BGA OP

    3M

    2,434
    RFQ

    -

    Textool™ Box Obsolete - - - - - - - - - - - - - - -
    234-3034-01-0602

    234-3034-01-0602

    CONN ZIG-ZAG ZIF 34POS GOLD

    3M

    2,284
    RFQ
    234-3034-01-0602

    Datasheet

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 34 (1 x 34) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    7100285426

    7100285426

    TEXTOOLBURN-IN GRID ZIP SOCKETS

    3M

    2,710
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    2256-9020-00-2401

    2256-9020-00-2401

    3M TEXTOOL 2256-9020-00-2401 PP1

    3M

    2,705
    RFQ

    -

    Textool™ Bulk Obsolete - - - - - - - - - - - - - - -
    235-3019-01-0602

    235-3019-01-0602

    CONN ZIG-ZAG ZIF 35POS GOLD

    3M

    3,193
    RFQ
    235-3019-01-0602

    Datasheet

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
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