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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
12-6810-90CCONN IC DIP SOCKET 12POS GOLD |
45 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 12 (2 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
APA-640-T-BADAPTER PLUG |
100 |
|
Datasheet |
APA | Bulk | Active | - | 40 (2 x 20) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
APA-640-G-A1ADAPTER PLUG |
98 |
|
Datasheet |
APA | Bulk | Active | - | 40 (2 x 20) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 20.0µin (0.51µm) | Phosphor Bronze |
|
28-823-90CCONN IC DIP SOCKET 28POS GOLD |
7 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
299-93-628-10-002000CONN IC DIP SOCKET 28POS GOLD |
56 |
|
Datasheet |
299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-13-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
30 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
APA-316-G-PADAPTER PLUG |
26 |
|
Datasheet |
APA | Tube | Active | - | 16 (2 x 8) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 20.0µin (0.51µm) | Phosphor Bronze |
|
40-516-11CONN IC DIP SOCKET ZIF 40POS GLD |
20 |
|
Datasheet |
516 | Bulk | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
110-13-324-41-801000CONN IC DIP SOCKET 24POS GOLD |
55 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
209-PGM17020-10CONN SOCKET PGA GOLD |
8 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
2-2129710-8CONN SOCKET LGA 3647POS GOLD |
34 |
|
Datasheet |
- | Tray | Active | LGA | 3647 | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | - | Solder | - | - | - | Thermoplastic | - | Copper Alloy |
|
256-1292-00-0602JCONN IC DIP SOCKET ZIF 56POS GLD |
13 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 56 (2 x 28) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.070" (1.78mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
260-4204-01CONN SOCKET QFN 60POS GOLD |
14 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 60 (4 x 15) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.016" (0.40mm) | Solder | 0.016" (0.40mm) | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
ICO-314-STTCONN IC DIP SOCKET 14POS TIN |
68 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyester, Glass Filled | - | Brass |
|
123-83-314-41-001101CONN IC DIP SOCKET 14POS GOLD |
30 |
|
Datasheet |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
4590CONN TRANSIST TO-5 3POS TIN |
58 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-5 | 3 (Round) | Tin | - | Brass | Chassis Mount | Closed Frame | - | Solder | - | - | Tin | Polyester, Glass Filled | - | Brass |
|
|
APA-314-T-A1ADAPTER PLUG |
98 |
|
Datasheet |
APA | Bulk | Active | - | 14 (2 x 7) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
299-83-308-10-001101CONN IC DIP SOCKET 8POS GOLD |
47 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
ICO-320-MTT.100" LOW PROFILE SCREW MACHINE |
66 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyester, Glass Filled | - | Brass |
|
|
XR2C-2015CONN SOCKET SIP 20POS GOLD |
43 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 20 (1 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
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