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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-0226-T-T

    APH-0226-T-T

    APH-0226-T-T

    Samtec Inc.

    		 2,748
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1326-T-T

    APH-1326-T-T

    APH-1326-T-T

    Samtec Inc.

    		 4,962
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0326-T-T

    APH-0326-T-T

    APH-0326-T-T

    Samtec Inc.

    		 2,563
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    100-PGM13061-10

    100-PGM13061-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,933
    RFQ
    		100-PGM13061-10

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    104-13-324-41-770000

    104-13-324-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,974
    RFQ
    		104-13-324-41-770000

    Datasheet

         		104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
    104-13-424-41-770000

    104-13-424-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,070
    RFQ
    		104-13-424-41-770000

    Datasheet

         		104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
    104-13-624-41-770000

    104-13-624-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,427
    RFQ
    		104-13-624-41-770000

    Datasheet

         		104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
    517-87-320-19-131111

    517-87-320-19-131111

    CONN SOCKET PGA 320POS GOLD

    Preci-Dip

    		 2,925
    RFQ
    		517-87-320-19-131111

    Datasheet

         		517 Bulk Active PGA 320 (19 x 19) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    HLS-0218-T-12

    HLS-0218-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,346
    RFQ
    		HLS-0218-T-12

    Datasheet

         		HLS Tube Active SIP 36 (2 x 18) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    20-9503-21

    20-9503-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,957
    RFQ
    		20-9503-21

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    20-9503-31

    20-9503-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,745
    RFQ
    		20-9503-31

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    APA-422-G-C

    APA-422-G-C

    ADAPTER PLUG

    Samtec Inc.

    		 3,853
    RFQ
    		APA-422-G-C

    Datasheet

         		APA Bulk Active - 22 (2 x 11) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
    APO-322-G-C

    APO-322-G-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,031
    RFQ
    		APO-322-G-C

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    APA-632-G-A1

    APA-632-G-A1

    ADAPTER PLUG

    Samtec Inc.

    		 4,596
    RFQ
    		APA-632-G-A1

    Datasheet

         		APA Bulk Active - 32 (2 x 16) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
    210-11-636-41-001000

    210-11-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,885
    RFQ
    		210-11-636-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    116-41-642-41-006000

    116-41-642-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,638
    RFQ
    		116-41-642-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-91-642-41-006000

    116-91-642-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,533
    RFQ
    		116-91-642-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    114-41-652-41-117000

    114-41-652-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,753
    RFQ
    		114-41-652-41-117000

    Datasheet

         		114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    114-91-652-41-117000

    114-91-652-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,165
    RFQ
    		114-91-652-41-117000

    Datasheet

         		114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    114-93-636-41-117000

    114-93-636-41-117000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,570
    RFQ
    		114-93-636-41-117000

    Datasheet

         		114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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