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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0226-T-T

    APH-0226-T-T

    APH-0226-T-T

    Samtec Inc.

    		 2,748
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1326-T-T

    APH-1326-T-T

    APH-1326-T-T

    Samtec Inc.

    		 4,962
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0326-T-T

    APH-0326-T-T

    APH-0326-T-T

    Samtec Inc.

    		 2,563
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    100-PGM13061-10

    100-PGM13061-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,933
    RFQ
    		100-PGM13061-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    104-13-324-41-770000

    104-13-324-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,974
    RFQ
    		104-13-324-41-770000

    Datasheet

         		104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    104-13-424-41-770000

    104-13-424-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,070
    RFQ
    		104-13-424-41-770000

    Datasheet

         		104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    104-13-624-41-770000

    104-13-624-41-770000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,427
    RFQ
    		104-13-624-41-770000

    Datasheet

         		104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    517-87-320-19-131111

    517-87-320-19-131111

    CONN SOCKET PGA 320POS GOLD

    Preci-Dip

    		 2,925
    RFQ
    		517-87-320-19-131111

    Datasheet

         		517 Bulk Active PGA 320 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0218-T-12

    HLS-0218-T-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,346
    RFQ
    		HLS-0218-T-12

    Datasheet

         		HLS Tube Active SIP 36 (2 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    20-9503-21

    20-9503-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,957
    RFQ
    		20-9503-21

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-9503-31

    20-9503-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,745
    RFQ
    		20-9503-31

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-422-G-C

    APA-422-G-C

    ADAPTER PLUG

    Samtec Inc.

    		 3,853
    RFQ
    		APA-422-G-C

    Datasheet

         		APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-322-G-C

    APO-322-G-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,031
    RFQ
    		APO-322-G-C

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APA-632-G-A1

    APA-632-G-A1

    ADAPTER PLUG

    Samtec Inc.

    		 4,596
    RFQ
    		APA-632-G-A1

    Datasheet

         		APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    210-11-636-41-001000

    210-11-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,885
    RFQ
    		210-11-636-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-642-41-006000

    116-41-642-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,638
    RFQ
    		116-41-642-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-642-41-006000

    116-91-642-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,533
    RFQ
    		116-91-642-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-41-652-41-117000

    114-41-652-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,753
    RFQ
    		114-41-652-41-117000

    Datasheet

         		114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-652-41-117000

    114-91-652-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,165
    RFQ
    		114-91-652-41-117000

    Datasheet

         		114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-636-41-117000

    114-93-636-41-117000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,570
    RFQ
    		114-93-636-41-117000

    Datasheet

         		114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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